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NB7VPQ702MMUTXG onsemi

Part No.:: NB7VPQ702MMUTXG

Manufacturer:: onsemi

Category:: Interface - Signal Buffers, Repeaters, Splitters

Package:: 16-UFQFN Exposed Pad

Datasheet:: NB7VPQ702MMUTXG.pdf

Description:: IC REDRIVER USB 3.1 DUAL 16UQFN

Quantity:: RFQ Add to RFQ List Buy Now Add to Cart

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Application Scenarios

What Applications Is NB7VPQ702MMUTXG Suitable For?

NB7VPQ702MMUTXG is a Interface - Signal Buffers, Repeaters, Splitters product from onsemi, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Interface - Signal Buffers, Repeaters, Splitters components. Engineers can review the NB7VPQ702MMUTXG datasheet, package 16-UFQFN Exposed Pad and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original onsemi components are required, helping engineers evaluate NB7VPQ702MMUTXG specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the NB7VPQ702MMUTXG description, package 16-UFQFN Exposed Pad and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports NB7VPQ702MMUTXG datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for NB7VPQ702MMUTXG Pricing & Technical Support

Product Overview

NB7VPQ702MMUTXG is a Interface - Signal Buffers, Repeaters, Splitters product from onsemi. It is supplied in package 16-UFQFN Exposed Pad and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide NB7VPQ702MMUTXG datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: IC REDRIVER USB 3.1 DUAL 16UQFN

Key Features

Part Number:NB7VPQ702MMUTXG
Manufacturer:onsemi
Category:Interface - Signal Buffers, Repeaters, Splitters
Package:16-UFQFN Exposed Pad
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

NB7VPQ702MMUTXG may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for NB7VPQ702MMUTXG stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Package/Case:

16-UFQFN Exposed Pad
Packaging:

Tape & Reel (TR),Cut Tape (CT),Bulk
Series:

-
ProductStatus:

Obsolete
Type:

Buffer, ReDriver
Applications:

USB
Input:

CML
Output:

CML
DataRate(Max):

10Gbps
NumberofChannels:

2
DelayTime:

150ps
SignalConditioning:

Input Equalization, Output De-Emphasis
Capacitance-Input:

1.25 pF
Voltage-Supply:

1.71V ~ 1.89V
Current-Supply:

-
OperatingTemperature:

-40°C ~ 85°C
MountingType:

Surface Mount
Category:

Interface - Signal Buffers, Repeaters, Splitters
Datasheet:

NB7VPQ702MMUTXG.pdf

NB7VPQ702MMUTXG Frequently Asked Questions

Is NB7VPQ702MMUTXG currently in stock? ▼

FudongIC currently shows 27,000 units of NB7VPQ702MMUTXG in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for NB7VPQ702MMUTXG? ▼

The minimum order quantity currently shown for NB7VPQ702MMUTXG is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is NB7VPQ702MMUTXG original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for NB7VPQ702MMUTXG, please note this in your RFQ.

Can you provide a datasheet or technical support for NB7VPQ702MMUTXG? ▼

Yes. You can view or download the NB7VPQ702MMUTXG.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for NB7VPQ702MMUTXG, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for NB7VPQ702MMUTXG? ▼

Yes. Based on your application, preferred manufacturer, package 16-UFQFN Exposed Pad, electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for NB7VPQ702MMUTXG. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use NB7VPQ702MMUTXG? ▼

As a Interface - Signal Buffers, Repeaters, Splitters product from onsemi, NB7VPQ702MMUTXG may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.