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NCV20092DR2G onsemi

Part No.:: NCV20092DR2G

Manufacturer:: onsemi

Category:: Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps

Package:: 8-SOIC (0.154, 3.90mm Width)

Datasheet:: NCV20092DR2G.pdf

Description:: IC OPAMP GP 2 CIRCUIT 8SOIC

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Application Scenarios

What Applications Is NCV20092DR2G Suitable For?

NCV20092DR2G is a Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps product from onsemi, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps components. Engineers can review the NCV20092DR2G datasheet, package 8-SOIC (0.154, 3.90mm Width) and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original onsemi components are required, helping engineers evaluate NCV20092DR2G specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the NCV20092DR2G description, package 8-SOIC (0.154, 3.90mm Width) and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports NCV20092DR2G datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for NCV20092DR2G Pricing & Technical Support

Product Overview

NCV20092DR2G is a Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps product from onsemi. It is supplied in package 8-SOIC (0.154, 3.90mm Width) and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide NCV20092DR2G datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: IC OPAMP GP 2 CIRCUIT 8SOIC

Key Features

Part Number:NCV20092DR2G
Manufacturer:onsemi
Category:Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps
Package:8-SOIC (0.154, 3.90mm Width)
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

NCV20092DR2G may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for NCV20092DR2G stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Package/Case:

8-SOIC (0.154, 3.90mm Width)
Packaging:

Tape & Reel (TR)
Series:

-
ProductStatus:

Active
AmplifierType:

General Purpose
NumberofCircuits:

2
OutputType:

Rail-to-Rail
SlewRate:

0.17V/µs
GainBandwidthProduct:

350 kHz
-3dbBandwidth:

-
Current-InputBias:

1 pA
Voltage-InputOffset:

500 µV
Current-Supply:

23µA (x2 Channels)
Current-Output/Channel:

8.5 mA
Voltage-SupplySpan(Min):

1.8 V
Voltage-SupplySpan(Max):

5.5 V
OperatingTemperature:

-40°C ~ 125°C
MountingType:

Surface Mount
Category:

Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps
Datasheet:

NCV20092DR2G.pdf

NCV20092DR2G Frequently Asked Questions

Is NCV20092DR2G currently in stock? ▼

FudongIC currently shows 2,677 units of NCV20092DR2G in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for NCV20092DR2G? ▼

The minimum order quantity currently shown for NCV20092DR2G is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is NCV20092DR2G original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for NCV20092DR2G, please note this in your RFQ.

Can you provide a datasheet or technical support for NCV20092DR2G? ▼

Yes. You can view or download the NCV20092DR2G.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for NCV20092DR2G, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for NCV20092DR2G? ▼

Yes. Based on your application, preferred manufacturer, package 8-SOIC (0.154, 3.90mm Width), electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for NCV20092DR2G. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use NCV20092DR2G? ▼

As a Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps product from onsemi, NCV20092DR2G may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.