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OM13493UL NXP USA Inc.

Part No.:: OM13493UL

Manufacturer:: NXP USA Inc.

Category:: Prototyping Boards, Fabrication Kits

Package:

Datasheet:: OM13493UL.pdf

Description:: SURFACE MOUNT TO DIP EVALUATION

Quantity:: RFQ Add to RFQ List Buy Now Add to Cart

Unit Price:Request Quote

Total:Submit an RFQ for pricing

Payment:

Shipping:

Application Scenarios

What Applications Is OM13493UL Suitable For?

OM13493UL is a Prototyping Boards, Fabrication Kits product from NXP USA Inc., suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Prototyping Boards, Fabrication Kits components. Engineers can review the OM13493UL datasheet, package and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original NXP USA Inc. components are required, helping engineers evaluate OM13493UL specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the OM13493UL description, package and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports OM13493UL datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for OM13493UL Pricing & Technical Support

Product Overview

OM13493UL is a Prototyping Boards, Fabrication Kits product from NXP USA Inc.. It is supplied in package and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide OM13493UL datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: SURFACE MOUNT TO DIP EVALUATION

Key Features

Part Number:OM13493UL
Manufacturer:NXP USA Inc.
Category:Prototyping Boards, Fabrication Kits
Package:
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

OM13493UL may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for OM13493UL stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Packaging:

Bulk
Series:

-
ProductStatus:

Active
KitType:

Adapter, Breakout Boards
Quantity:

24 Pieces (4 Values - 6 Each)
PackageAccepted:

DHVQFN
Specifications:

SMD to DIP
Category:

Prototyping Boards, Fabrication Kits
Datasheet:

OM13493UL.pdf

OM13493UL Frequently Asked Questions

Is OM13493UL currently in stock? ▼

FudongIC currently shows 3,254 units of OM13493UL in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for OM13493UL? ▼

The minimum order quantity currently shown for OM13493UL is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is OM13493UL original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for OM13493UL, please note this in your RFQ.

Can you provide a datasheet or technical support for OM13493UL? ▼

Yes. You can view or download the OM13493UL.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for OM13493UL, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for OM13493UL? ▼

Yes. Based on your application, preferred manufacturer, package , electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for OM13493UL. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use OM13493UL? ▼

As a Prototyping Boards, Fabrication Kits product from NXP USA Inc., OM13493UL may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.