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OSTYC192150 On Shore Technology Inc.

Q: Is OSTYC192150 currently in stock?

FudongIC currently shows 2255 units of OSTYC192150 in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

OSTYC192150 On Shore Technology Inc. Terminal Blocks - Wire to Board

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Part No.:: OSTYC192150

Manufacturer:: On Shore Technology Inc.

Category:: Terminal Blocks - Wire to Board

Package:

Datasheet:: OSTYC192150.pdf

Description:: TERM BLK 19P SIDE ENT 5.08MM PCB

Quantity:: RFQ Add to RFQ List Buy Now Add to Cart

Unit Price:Request Quote

Total:Submit an RFQ for pricing

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Application Scenarios

What Applications Is OSTYC192150 Suitable For?

OSTYC192150 is a Terminal Blocks - Wire to Board product from On Shore Technology Inc., suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Terminal Blocks - Wire to Board components. Engineers can review the OSTYC192150 datasheet, package and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original On Shore Technology Inc. components are required, helping engineers evaluate OSTYC192150 specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the OSTYC192150 description, package and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports OSTYC192150 datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for OSTYC192150 Pricing & Technical Support

Product Overview

OSTYC192150 is a Terminal Blocks - Wire to Board product from On Shore Technology Inc.. It is supplied in package and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide OSTYC192150 datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: TERM BLK 19P SIDE ENT 5.08MM PCB

Key Features

Part Number:OSTYC192150
Manufacturer:On Shore Technology Inc.
Category:Terminal Blocks - Wire to Board
Package:
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

OSTYC192150 may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for OSTYC192150 stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Packaging:

Bulk
Series:

OSTYC
RoHS:

RoHS
Color:

Green
Pitch:

0.200" (5.08mm)
Current:

10 A
Voltage:

300 V
Features:

Interlocking (Side)
Wire Gauge:

16-26 AWG
Part Status:

Active
Mounting Type:

Through Hole
Number of Levels:

1
Wire Termination:

Screw - Rising Cage Clamp
Mating Orientation:

Horizontal with Board
Positions Per Level:

19
Category:

Terminal Blocks - Wire to Board
Datasheet:

OSTYC192150.pdf

OSTYC192150 Frequently Asked Questions

Is OSTYC192150 currently in stock? ▼

FudongIC currently shows 2,255 units of OSTYC192150 in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for OSTYC192150? ▼

The minimum order quantity currently shown for OSTYC192150 is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is OSTYC192150 original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for OSTYC192150, please note this in your RFQ.

Can you provide a datasheet or technical support for OSTYC192150? ▼

Yes. You can view or download the OSTYC192150.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for OSTYC192150, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for OSTYC192150? ▼

Yes. Based on your application, preferred manufacturer, package , electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for OSTYC192150. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use OSTYC192150? ▼

As a Terminal Blocks - Wire to Board product from On Shore Technology Inc., OSTYC192150 may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.