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P1012NSN2FFB NXP USA Inc.

Part No.:: P1012NSN2FFB

Manufacturer:: NXP USA Inc.

Category:: Embedded - Microprocessors

Package:: 689-BBGA Exposed Pad

Datasheet:: P1012NSN2FFB.pdf

Description:: IC MPU Q OR IQ 800MHZ 689TEBGA

Quantity:: RFQ Add to RFQ List Buy Now Add to Cart

Unit Price:Request Quote

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Application Scenarios

What Applications Is P1012NSN2FFB Suitable For?

P1012NSN2FFB is a Embedded - Microprocessors product from NXP USA Inc., suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Embedded - Microprocessors components. Engineers can review the P1012NSN2FFB datasheet, package 689-BBGA Exposed Pad and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original NXP USA Inc. components are required, helping engineers evaluate P1012NSN2FFB specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the P1012NSN2FFB description, package 689-BBGA Exposed Pad and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports P1012NSN2FFB datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for P1012NSN2FFB Pricing & Technical Support

Product Overview

P1012NSN2FFB is a Embedded - Microprocessors product from NXP USA Inc.. It is supplied in package 689-BBGA Exposed Pad and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide P1012NSN2FFB datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: IC MPU Q OR IQ 800MHZ 689TEBGA

Key Features

Part Number:P1012NSN2FFB
Manufacturer:NXP USA Inc.
Category:Embedded - Microprocessors
Package:689-BBGA Exposed Pad
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

P1012NSN2FFB may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for P1012NSN2FFB stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Package/Case:

689-BBGA Exposed Pad
Packaging:

Tray
Series:

QorIQ P1
ProductStatus:

Obsolete
CoreProcessor:

PowerPC e500v2
NumberofCores/BusWidth:

1 Core, 32-Bit
Speed:

800MHz
Co-Processors/DSP:

Communications; QUICC Engine
RAMControllers:

DDR2, DDR3
GraphicsAcceleration:

No
Display&InterfaceControllers:

-
Ethernet:

10/100/1000Mbps (3)
SATA:

-
USB:

USB 2.0 + PHY (2)
Voltage-I/O:

-
OperatingTemperature:

0°C ~ 125°C (TA)
SecurityFeatures:

-
Category:

Embedded - Microprocessors
Datasheet:

P1012NSN2FFB.pdf

P1012NSN2FFB Frequently Asked Questions

Is P1012NSN2FFB currently in stock? ▼

FudongIC currently shows 2,771 units of P1012NSN2FFB in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for P1012NSN2FFB? ▼

The minimum order quantity currently shown for P1012NSN2FFB is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is P1012NSN2FFB original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for P1012NSN2FFB, please note this in your RFQ.

Can you provide a datasheet or technical support for P1012NSN2FFB? ▼

Yes. You can view or download the P1012NSN2FFB.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for P1012NSN2FFB, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for P1012NSN2FFB? ▼

Yes. Based on your application, preferred manufacturer, package 689-BBGA Exposed Pad, electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for P1012NSN2FFB. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use P1012NSN2FFB? ▼

As a Embedded - Microprocessors product from NXP USA Inc., P1012NSN2FFB may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.