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PI6ULS5V9509XTEX Diodes Incorporated

Part No.:: PI6ULS5V9509XTEX

Manufacturer:: Diodes Incorporated

Category:: Interface - Signal Buffers, Repeaters, Splitters

Package:: 8-UFQFN Exposed Pad

Datasheet:: PI6ULS5V9509XTEX.pdf

Description:: IC BUFFER I2C/SMBUS 8UQFN

Quantity:: RFQ Add to RFQ List Buy Now Add to Cart

Unit Price:Request Quote

Total:Submit an RFQ for pricing

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Application Scenarios

What Applications Is PI6ULS5V9509XTEX Suitable For?

PI6ULS5V9509XTEX is a Interface - Signal Buffers, Repeaters, Splitters product from Diodes Incorporated, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Interface - Signal Buffers, Repeaters, Splitters components. Engineers can review the PI6ULS5V9509XTEX datasheet, package 8-UFQFN Exposed Pad and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original Diodes Incorporated components are required, helping engineers evaluate PI6ULS5V9509XTEX specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the PI6ULS5V9509XTEX description, package 8-UFQFN Exposed Pad and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports PI6ULS5V9509XTEX datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for PI6ULS5V9509XTEX Pricing & Technical Support

Product Overview

PI6ULS5V9509XTEX is a Interface - Signal Buffers, Repeaters, Splitters product from Diodes Incorporated. It is supplied in package 8-UFQFN Exposed Pad and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide PI6ULS5V9509XTEX datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: IC BUFFER I2C/SMBUS 8UQFN

Key Features

Part Number:PI6ULS5V9509XTEX
Manufacturer:Diodes Incorporated
Category:Interface - Signal Buffers, Repeaters, Splitters
Package:8-UFQFN Exposed Pad
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

PI6ULS5V9509XTEX may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for PI6ULS5V9509XTEX stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Package/Case:

8-UFQFN Exposed Pad
Packaging:

Tape & Reel (TR)
Series:

-
ProductStatus:

Obsolete
Type:

Buffer, ReDriver
Applications:

I²C
Input:

2-Wire Bus
Output:

2-Wire Bus
DataRate(Max):

400kHz
NumberofChannels:

1
DelayTime:

-
SignalConditioning:

-
Capacitance-Input:

6 pF
Voltage-Supply:

3V ~ 5.5V
Current-Supply:

3mA
OperatingTemperature:

-
MountingType:

Surface Mount
Category:

Interface - Signal Buffers, Repeaters, Splitters
Datasheet:

PI6ULS5V9509XTEX.pdf

PI6ULS5V9509XTEX Frequently Asked Questions

Is PI6ULS5V9509XTEX currently in stock? ▼

FudongIC currently shows 3,928 units of PI6ULS5V9509XTEX in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for PI6ULS5V9509XTEX? ▼

The minimum order quantity currently shown for PI6ULS5V9509XTEX is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is PI6ULS5V9509XTEX original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for PI6ULS5V9509XTEX, please note this in your RFQ.

Can you provide a datasheet or technical support for PI6ULS5V9509XTEX? ▼

Yes. You can view or download the PI6ULS5V9509XTEX.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for PI6ULS5V9509XTEX, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for PI6ULS5V9509XTEX? ▼

Yes. Based on your application, preferred manufacturer, package 8-UFQFN Exposed Pad, electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for PI6ULS5V9509XTEX. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use PI6ULS5V9509XTEX? ▼

As a Interface - Signal Buffers, Repeaters, Splitters product from Diodes Incorporated, PI6ULS5V9509XTEX may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.