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PIC16LF19186T-I/MV Microchip Technology

Part No.:: PIC16LF19186T-I/MV

Manufacturer:: Microchip Technology

Category:: Embedded - Microcontrollers

Package:: 48-UFQFN Exposed Pad

Datasheet:: PIC16LF19186T-I/MV.pdf

Description:: IC MCU 8BIT 28KB FLASH 48UQFN

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Application Scenarios

What Applications Is PIC16LF19186T-I/MV Suitable For?

PIC16LF19186T-I/MV is a Embedded - Microcontrollers product from Microchip Technology, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Embedded - Microcontrollers components. Engineers can review the PIC16LF19186T-I/MV datasheet, package 48-UFQFN Exposed Pad and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original Microchip Technology components are required, helping engineers evaluate PIC16LF19186T-I/MV specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the PIC16LF19186T-I/MV description, package 48-UFQFN Exposed Pad and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports PIC16LF19186T-I/MV datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for PIC16LF19186T-I/MV Pricing & Technical Support

Product Overview

PIC16LF19186T-I/MV is a Embedded - Microcontrollers product from Microchip Technology. It is supplied in package 48-UFQFN Exposed Pad and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide PIC16LF19186T-I/MV datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: IC MCU 8BIT 28KB FLASH 48UQFN

Key Features

Part Number:PIC16LF19186T-I/MV
Manufacturer:Microchip Technology
Category:Embedded - Microcontrollers
Package:48-UFQFN Exposed Pad
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

PIC16LF19186T-I/MV may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for PIC16LF19186T-I/MV stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Package/Case:

48-UFQFN Exposed Pad
Packaging:

Tape & Reel (TR),Cut Tape (CT)
Series:

PIC® XLP™ 16F
ProductStatus:

RoHS
CoreProcessor:

32MHz
CoreSize:

2K x 8
Speed:

8-Bit
Connectivity:

256 x 8
Peripherals:

Active
NumberofI/O:

Brown-out Detect/Reset, LCD, POR, PWM, WDT
ProgramMemorySize:

I²C, LINbus, SPI, UART/USART
ProgramMemoryType:

Surface Mount
EEPROMSize:

43
RAMSize:

PIC
Voltage-Supply(Vcc/Vdd):

A/D 39x12b; D/A 1x5b
DataConverters:

Internal
OscillatorType:

28KB (16K x 14)
OperatingTemperature:

FLASH
MountingType:

-40°C ~ 85°C (TA)
Category:

Embedded - Microcontrollers
Datasheet:

PIC16LF19186T-I/MV.pdf

PIC16LF19186T-I/MV Frequently Asked Questions

Is PIC16LF19186T-I/MV currently in stock? ▼

FudongIC currently shows 2,493 units of PIC16LF19186T-I/MV in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for PIC16LF19186T-I/MV? ▼

The minimum order quantity currently shown for PIC16LF19186T-I/MV is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is PIC16LF19186T-I/MV original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for PIC16LF19186T-I/MV, please note this in your RFQ.

Can you provide a datasheet or technical support for PIC16LF19186T-I/MV? ▼

Yes. You can view or download the PIC16LF19186T-I/MV.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for PIC16LF19186T-I/MV, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for PIC16LF19186T-I/MV? ▼

Yes. Based on your application, preferred manufacturer, package 48-UFQFN Exposed Pad, electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for PIC16LF19186T-I/MV. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use PIC16LF19186T-I/MV? ▼

As a Embedded - Microcontrollers product from Microchip Technology, PIC16LF19186T-I/MV may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.