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R2J20602NP#G3 Renesas Electronics America Inc

Part No.:: R2J20602NP#G3

Manufacturer:: Renesas Electronics America Inc

Category:: PMIC - Full, Half-Bridge Drivers

Package:: 56-VFQFN Exposed Pad

Datasheet:: R2J20602NP#G3.pdf

Description:: IC MOSFET DRVR 12V 40A 56-QFN

Quantity:: RFQ Add to RFQ List Buy Now Add to Cart

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Application Scenarios

What Applications Is R2J20602NP#G3 Suitable For?

R2J20602NP#G3 is a PMIC - Full, Half-Bridge Drivers product from Renesas Electronics America Inc, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable PMIC - Full, Half-Bridge Drivers components. Engineers can review the R2J20602NP#G3 datasheet, package 56-VFQFN Exposed Pad and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original Renesas Electronics America Inc components are required, helping engineers evaluate R2J20602NP#G3 specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the R2J20602NP#G3 description, package 56-VFQFN Exposed Pad and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports R2J20602NP#G3 datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for R2J20602NP#G3 Pricing & Technical Support

Product Overview

R2J20602NP#G3 is a PMIC - Full, Half-Bridge Drivers product from Renesas Electronics America Inc. It is supplied in package 56-VFQFN Exposed Pad and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide R2J20602NP#G3 datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: IC MOSFET DRVR 12V 40A 56-QFN

Key Features

Part Number:R2J20602NP#G3
Manufacturer:Renesas Electronics America Inc
Category:PMIC - Full, Half-Bridge Drivers
Package:56-VFQFN Exposed Pad
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

R2J20602NP#G3 may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for R2J20602NP#G3 stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Packaging:

Cut Tape (CT)
Series:

-
ProductStatus:

Obsolete
OutputConfiguration:

Half Bridge
Applications:

Buck Converters
Interface:

PWM
LoadType:

Inductive
Technology:

DrMOS
RdsOn(Typ):

-
Current-Output/Channel:

-
Current-PeakOutput:

40A
Voltage-Supply:

7V ~ 7.8V
Voltage-Load:

7V ~ 7.8V
OperatingTemperature:

-40°C ~ 150°C (TJ)
Features:

Status Flag
FaultProtection:

Current Limiting, Over Temperature, Short Circuit, UVLO
MountingType:

Surface Mount
Category:

PMIC - Full, Half-Bridge Drivers
Datasheet:

R2J20602NP#G3.pdf

R2J20602NP#G3 Frequently Asked Questions

Is R2J20602NP#G3 currently in stock? ▼

FudongIC currently shows 3,722 units of R2J20602NP#G3 in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for R2J20602NP#G3? ▼

The minimum order quantity currently shown for R2J20602NP#G3 is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is R2J20602NP#G3 original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for R2J20602NP#G3, please note this in your RFQ.

Can you provide a datasheet or technical support for R2J20602NP#G3? ▼

Yes. You can view or download the R2J20602NP#G3.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for R2J20602NP#G3, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for R2J20602NP#G3? ▼

Yes. Based on your application, preferred manufacturer, package 56-VFQFN Exposed Pad, electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for R2J20602NP#G3. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use R2J20602NP#G3? ▼

As a PMIC - Full, Half-Bridge Drivers product from Renesas Electronics America Inc, R2J20602NP#G3 may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.