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R8A774E0HA01BN#G0 Renesas Electronics America Inc

Part No.:: R8A774E0HA01BN#G0

Manufacturer:: Renesas Electronics America Inc

Category:: Embedded - Microprocessors

Package:: 1022-BGA

Datasheet:: R8A774E0HA01BN#G0.pdf

Description:: SOC RZ/G2H HDMI-OFF

Quantity:: RFQ Add to RFQ List Buy Now Add to Cart

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Application Scenarios

What Applications Is R8A774E0HA01BN#G0 Suitable For?

R8A774E0HA01BN#G0 is a Embedded - Microprocessors product from Renesas Electronics America Inc, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Embedded - Microprocessors components. Engineers can review the R8A774E0HA01BN#G0 datasheet, package 1022-BGA and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original Renesas Electronics America Inc components are required, helping engineers evaluate R8A774E0HA01BN#G0 specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the R8A774E0HA01BN#G0 description, package 1022-BGA and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports R8A774E0HA01BN#G0 datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for R8A774E0HA01BN#G0 Pricing & Technical Support

Product Overview

R8A774E0HA01BN#G0 is a Embedded - Microprocessors product from Renesas Electronics America Inc. It is supplied in package 1022-BGA and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide R8A774E0HA01BN#G0 datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: SOC RZ/G2H HDMI-OFF

Key Features

Part Number:R8A774E0HA01BN#G0
Manufacturer:Renesas Electronics America Inc
Category:Embedded - Microprocessors
Package:1022-BGA
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

R8A774E0HA01BN#G0 may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for R8A774E0HA01BN#G0 stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Package/Case:

1022-BGA
Packaging:

Tray
Series:

RZ/G2E
ProductStatus:

Active
CoreProcessor:

ARM® Cortex®-A53, ARM® Cortex®-A57
NumberofCores/BusWidth:

8 Core, 64-Bit
Speed:

1.2GHz, 1.5GHz
Co-Processors/DSP:

-
RAMControllers:

LPDDR4
GraphicsAcceleration:

No
Display&InterfaceControllers:

DU
Ethernet:

10/100Mbps (1), 100/1000Mbps (1)
SATA:

-
USB:

USB (4)
Voltage-I/O:

0.82V, 1.8V, 3.3V
OperatingTemperature:

-40°C ~ 85°C (TA)
SecurityFeatures:

-
Category:

Embedded - Microprocessors
Datasheet:

R8A774E0HA01BN#G0.pdf

R8A774E0HA01BN#G0 Frequently Asked Questions

Is R8A774E0HA01BN#G0 currently in stock? ▼

FudongIC currently shows 180 units of R8A774E0HA01BN#G0 in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for R8A774E0HA01BN#G0? ▼

The minimum order quantity currently shown for R8A774E0HA01BN#G0 is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is R8A774E0HA01BN#G0 original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for R8A774E0HA01BN#G0, please note this in your RFQ.

Can you provide a datasheet or technical support for R8A774E0HA01BN#G0? ▼

Yes. You can view or download the R8A774E0HA01BN#G0.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for R8A774E0HA01BN#G0, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for R8A774E0HA01BN#G0? ▼

Yes. Based on your application, preferred manufacturer, package 1022-BGA, electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for R8A774E0HA01BN#G0. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use R8A774E0HA01BN#G0? ▼

As a Embedded - Microprocessors product from Renesas Electronics America Inc, R8A774E0HA01BN#G0 may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.