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R9A07G075M01GFA#AA0 Renesas Electronics America Inc

Part No.:: R9A07G075M01GFA#AA0

Manufacturer:: Renesas Electronics America Inc

Category:: Embedded - Microprocessors

Package:: 128-LQFP Exposed Pad

Datasheet:: R9A07G075M01GFA#AA0.pdf

Description:: RZ/T2M MPU QFP128 NON-ETHER NON-

Quantity:: RFQ Add to RFQ List Buy Now Add to Cart

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Application Scenarios

What Applications Is R9A07G075M01GFA#AA0 Suitable For?

R9A07G075M01GFA#AA0 is a Embedded - Microprocessors product from Renesas Electronics America Inc, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Embedded - Microprocessors components. Engineers can review the R9A07G075M01GFA#AA0 datasheet, package 128-LQFP Exposed Pad and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original Renesas Electronics America Inc components are required, helping engineers evaluate R9A07G075M01GFA#AA0 specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the R9A07G075M01GFA#AA0 description, package 128-LQFP Exposed Pad and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports R9A07G075M01GFA#AA0 datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for R9A07G075M01GFA#AA0 Pricing & Technical Support

Product Overview

R9A07G075M01GFA#AA0 is a Embedded - Microprocessors product from Renesas Electronics America Inc. It is supplied in package 128-LQFP Exposed Pad and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide R9A07G075M01GFA#AA0 datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: RZ/T2M MPU QFP128 NON-ETHER NON-

Key Features

Part Number:R9A07G075M01GFA#AA0
Manufacturer:Renesas Electronics America Inc
Category:Embedded - Microprocessors
Package:128-LQFP Exposed Pad
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

R9A07G075M01GFA#AA0 may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for R9A07G075M01GFA#AA0 stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Package/Case:

128-LQFP Exposed Pad
Packaging:

Tray
Series:

RZ/T2M
ProductStatus:

Active
CoreProcessor:

ARM® Cortex®-R52
NumberofCores/BusWidth:

1 Core, 32-Bit
Speed:

600MHz, 800MHz
Co-Processors/DSP:

Multimedia; NEON™ SIMD
RAMControllers:

-
GraphicsAcceleration:

No
Display&InterfaceControllers:

-
Ethernet:

10/100/1000Mbps (2)
SATA:

-
USB:

USB 2.0 (1)
Voltage-I/O:

1.8V, 3.3V
OperatingTemperature:

-40°C ~ 125°C (TJ)
SecurityFeatures:

-
Category:

Embedded - Microprocessors
Datasheet:

R9A07G075M01GFA#AA0.pdf

R9A07G075M01GFA#AA0 Frequently Asked Questions

Is R9A07G075M01GFA#AA0 currently in stock? ▼

FudongIC currently shows 3,843 units of R9A07G075M01GFA#AA0 in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for R9A07G075M01GFA#AA0? ▼

The minimum order quantity currently shown for R9A07G075M01GFA#AA0 is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is R9A07G075M01GFA#AA0 original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for R9A07G075M01GFA#AA0, please note this in your RFQ.

Can you provide a datasheet or technical support for R9A07G075M01GFA#AA0? ▼

Yes. You can view or download the R9A07G075M01GFA#AA0.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for R9A07G075M01GFA#AA0, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for R9A07G075M01GFA#AA0? ▼

Yes. Based on your application, preferred manufacturer, package 128-LQFP Exposed Pad, electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for R9A07G075M01GFA#AA0. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use R9A07G075M01GFA#AA0? ▼

As a Embedded - Microprocessors product from Renesas Electronics America Inc, R9A07G075M01GFA#AA0 may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.