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RACF324DJT330R Stackpole Electronics Inc

Part No.:: RACF324DJT330R

Manufacturer:: Stackpole Electronics Inc

Category:: Resistor Networks, Arrays

Package:: 2010 (5025 Metric), Concave, Long Side Terminals

Datasheet:: RACF324DJT330R.pdf

Description:: RES ARRAY 4 RES 330 OHM 2010

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Application Scenarios

What Applications Is RACF324DJT330R Suitable For?

RACF324DJT330R is a Resistor Networks, Arrays product from Stackpole Electronics Inc, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Resistor Networks, Arrays components. Engineers can review the RACF324DJT330R datasheet, package 2010 (5025 Metric), Concave, Long Side Terminals and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original Stackpole Electronics Inc components are required, helping engineers evaluate RACF324DJT330R specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the RACF324DJT330R description, package 2010 (5025 Metric), Concave, Long Side Terminals and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports RACF324DJT330R datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for RACF324DJT330R Pricing & Technical Support

Product Overview

RACF324DJT330R is a Resistor Networks, Arrays product from Stackpole Electronics Inc. It is supplied in package 2010 (5025 Metric), Concave, Long Side Terminals and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide RACF324DJT330R datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: RES ARRAY 4 RES 330 OHM 2010

Key Features

Part Number:RACF324DJT330R
Manufacturer:Stackpole Electronics Inc
Category:Resistor Networks, Arrays
Package:2010 (5025 Metric), Concave, Long Side Terminals
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

RACF324DJT330R may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for RACF324DJT330R stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Package/Case:

2010 (5025 Metric), Concave, Long Side Terminals
Packaging:

Tape & Reel (TR),Cut Tape (CT)
Series:

RACF
ProductStatus:

Obsolete
CircuitType:

Isolated
Resistance(Ohms):

330
Tolerance:

±5%
NumberofResistors:

4
ResistorMatchingRatio:

-
Resistor-Ratio-Drift:

-
NumberofPins:

8
PowerPerElement:

125mW
TemperatureCoefficient:

±200ppm/°C
OperatingTemperature:

-55°C ~ 125°C
Applications:

-
MountingType:

Surface Mount
Size/Dimension:

0.200 L x 0.118 W (5.08mm x 3.00mm)
Category:

Resistor Networks, Arrays
Datasheet:

RACF324DJT330R.pdf

RACF324DJT330R Frequently Asked Questions

Is RACF324DJT330R currently in stock? ▼

FudongIC currently shows 1,950 units of RACF324DJT330R in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for RACF324DJT330R? ▼

The minimum order quantity currently shown for RACF324DJT330R is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is RACF324DJT330R original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for RACF324DJT330R, please note this in your RFQ.

Can you provide a datasheet or technical support for RACF324DJT330R? ▼

Yes. You can view or download the RACF324DJT330R.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for RACF324DJT330R, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for RACF324DJT330R? ▼

Yes. Based on your application, preferred manufacturer, package 2010 (5025 Metric), Concave, Long Side Terminals, electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for RACF324DJT330R. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use RACF324DJT330R? ▼

As a Resistor Networks, Arrays product from Stackpole Electronics Inc, RACF324DJT330R may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.