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RAS-HS50-KIT Micro Connectors, Inc.

Part No.:: RAS-HS50-KIT

Manufacturer:: Micro Connectors, Inc.

Category:: Thermal - Heat Sinks

Package:: Development Boards, Raspberri Pi

Datasheet:: RAS-HS50-KIT.pdf

Description:: HEATSINK RASPBERRY PI KIT 50PCS

Quantity:: RFQ Add to RFQ List Buy Now Add to Cart

Unit Price:Request Quote

Total:Submit an RFQ for pricing

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Application Scenarios

What Applications Is RAS-HS50-KIT Suitable For?

RAS-HS50-KIT is a Thermal - Heat Sinks product from Micro Connectors, Inc., suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Thermal - Heat Sinks components. Engineers can review the RAS-HS50-KIT datasheet, package Development Boards, Raspberri Pi and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original Micro Connectors, Inc. components are required, helping engineers evaluate RAS-HS50-KIT specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the RAS-HS50-KIT description, package Development Boards, Raspberri Pi and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports RAS-HS50-KIT datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for RAS-HS50-KIT Pricing & Technical Support

Product Overview

RAS-HS50-KIT is a Thermal - Heat Sinks product from Micro Connectors, Inc.. It is supplied in package Development Boards, Raspberri Pi and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide RAS-HS50-KIT datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: HEATSINK RASPBERRY PI KIT 50PCS

Key Features

Part Number:RAS-HS50-KIT
Manufacturer:Micro Connectors, Inc.
Category:Thermal - Heat Sinks
Package:Development Boards, Raspberri Pi
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

RAS-HS50-KIT may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for RAS-HS50-KIT stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Packaging:

Retail Package
Series:

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ProductStatus:

Active
Type:

Top Mount Kit
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AttachmentMethod:

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Shape:

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Length:

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Width:

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Diameter:

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FinHeight:

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PowerDissipation@TemperatureRise:

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ThermalResistance@ForcedAirFlow:

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ThermalResistance@Natural:

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Material:
Category:

Thermal - Heat Sinks
Datasheet:

RAS-HS50-KIT.pdf

RAS-HS50-KIT Frequently Asked Questions

Is RAS-HS50-KIT currently in stock? ▼

FudongIC currently shows 900 units of RAS-HS50-KIT in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for RAS-HS50-KIT? ▼

The minimum order quantity currently shown for RAS-HS50-KIT is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is RAS-HS50-KIT original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for RAS-HS50-KIT, please note this in your RFQ.

Can you provide a datasheet or technical support for RAS-HS50-KIT? ▼

Yes. You can view or download the RAS-HS50-KIT.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for RAS-HS50-KIT, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for RAS-HS50-KIT? ▼

Yes. Based on your application, preferred manufacturer, package Development Boards, Raspberri Pi, electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for RAS-HS50-KIT. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use RAS-HS50-KIT? ▼

As a Thermal - Heat Sinks product from Micro Connectors, Inc., RAS-HS50-KIT may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.