SAA-XC866L-1FRA AB Infineon Technologies

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Part No.:: SAA-XC866L-1FRA AB

Manufacturer:: Infineon Technologies

Category:: Embedded - Microcontrollers

Package:: 38-TFSOP (0.173", 4.40mm Width)

Datasheet:: SAA-XC866L-1FRA AB.pdf

Description:: IC MCU 8BIT 4KB FLASH 38TSSOP

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Application Scenarios

What Applications Is SAA-XC866L-1FRA AB Suitable For?

SAA-XC866L-1FRA AB is a Embedded - Microcontrollers product from Infineon Technologies, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Embedded - Microcontrollers components. Engineers can review the SAA-XC866L-1FRA AB datasheet, package 38-TFSOP (0.173", 4.40mm Width) and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original Infineon Technologies components are required, helping engineers evaluate SAA-XC866L-1FRA AB specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the SAA-XC866L-1FRA AB description, package 38-TFSOP (0.173", 4.40mm Width) and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports SAA-XC866L-1FRA AB datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for SAA-XC866L-1FRA AB Pricing & Technical Support

Product Overview

SAA-XC866L-1FRA AB is a Embedded - Microcontrollers product from Infineon Technologies. It is supplied in package 38-TFSOP (0.173", 4.40mm Width) and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide SAA-XC866L-1FRA AB datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: IC MCU 8BIT 4KB FLASH 38TSSOP

Key Features

Part Number:SAA-XC866L-1FRA AB
Manufacturer:Infineon Technologies
Category:Embedded - Microcontrollers
Package:38-TFSOP (0.173", 4.40mm Width)
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

SAA-XC866L-1FRA AB may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for SAA-XC866L-1FRA AB stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Package/Case:

38-TFSOP (0.173", 4.40mm Width)
Packaging:

Tape & Reel (TR)
Series:

XC8xx
ProductStatus:

RoHS
CoreProcessor:

86MHz
CoreSize:

768 x 8
Speed:

8-Bit
Connectivity:

-
Peripherals:

Obsolete
NumberofI/O:

Brown-out Detect/Reset, POR, PWM, WDT
ProgramMemorySize:

LINbus, SSI, UART/USART
ProgramMemoryType:

Surface Mount
EEPROMSize:

27
RAMSize:

XC800
Voltage-Supply(Vcc/Vdd):

A/D 8x10b
DataConverters:

Internal
OscillatorType:

4KB (4K x 8)
OperatingTemperature:

FLASH
MountingType:

-40°C ~ 140°C (TA)
Category:

Embedded - Microcontrollers
Datasheet:

SAA-XC866L-1FRA AB.pdf

SAA-XC866L-1FRA AB Frequently Asked Questions

Is SAA-XC866L-1FRA AB currently in stock? ▼

FudongIC currently shows 3,175 units of SAA-XC866L-1FRA AB in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for SAA-XC866L-1FRA AB? ▼

The minimum order quantity currently shown for SAA-XC866L-1FRA AB is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is SAA-XC866L-1FRA AB original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for SAA-XC866L-1FRA AB, please note this in your RFQ.

Can you provide a datasheet or technical support for SAA-XC866L-1FRA AB? ▼

Yes. You can view or download the SAA-XC866L-1FRA AB.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for SAA-XC866L-1FRA AB, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for SAA-XC866L-1FRA AB? ▼

Yes. Based on your application, preferred manufacturer, package 38-TFSOP (0.173", 4.40mm Width), electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for SAA-XC866L-1FRA AB. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use SAA-XC866L-1FRA AB? ▼

As a Embedded - Microcontrollers product from Infineon Technologies, SAA-XC866L-1FRA AB may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.