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SAC57D53MCVMO NXP USA Inc.

Part No.:: SAC57D53MCVMO

Manufacturer:: NXP USA Inc.

Category:: Embedded - Microcontrollers

Package:: 516-BGA

Datasheet:: SAC57D53MCVMO.pdf

Description:: IC MCU 32BIT 3MB FLASH 516MAPBGA

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Application Scenarios

What Applications Is SAC57D53MCVMO Suitable For?

SAC57D53MCVMO is a Embedded - Microcontrollers product from NXP USA Inc., suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Embedded - Microcontrollers components. Engineers can review the SAC57D53MCVMO datasheet, package 516-BGA and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original NXP USA Inc. components are required, helping engineers evaluate SAC57D53MCVMO specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the SAC57D53MCVMO description, package 516-BGA and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports SAC57D53MCVMO datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for SAC57D53MCVMO Pricing & Technical Support

Product Overview

SAC57D53MCVMO is a Embedded - Microcontrollers product from NXP USA Inc.. It is supplied in package 516-BGA and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide SAC57D53MCVMO datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: IC MCU 32BIT 3MB FLASH 516MAPBGA

Key Features

Part Number:SAC57D53MCVMO
Manufacturer:NXP USA Inc.
Category:Embedded - Microcontrollers
Package:516-BGA
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

SAC57D53MCVMO may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for SAC57D53MCVMO stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Package/Case:

516-BGA
Packaging:

Tray
Series:

MAC57Dxxx
ProductStatus:

RoHS
CoreProcessor:

80MHz, 160MHz, 320MHz
CoreSize:

2.3M x 8
Speed:

32-Bit Tri-Core
Connectivity:

-
Peripherals:

Active
NumberofI/O:

DMA, LCD, LVD/HVD, POR, PWM, WDT
ProgramMemorySize:

CANbus, EBI/EMI, Ethernet, I²C, LINbus, SPI
ProgramMemoryType:

Surface Mount
EEPROMSize:

-
RAMSize:

ARM® Cortex®-A5, -M4, -M0+
Voltage-Supply(Vcc/Vdd):

A/D 24x12b
DataConverters:

Internal
OscillatorType:

3MB (3M x 8)
OperatingTemperature:

FLASH
MountingType:

-40°C ~ 105°C (TA)
Category:

Embedded - Microcontrollers
Datasheet:

SAC57D53MCVMO.pdf

SAC57D53MCVMO Frequently Asked Questions

Is SAC57D53MCVMO currently in stock? ▼

FudongIC currently shows 2,537 units of SAC57D53MCVMO in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for SAC57D53MCVMO? ▼

The minimum order quantity currently shown for SAC57D53MCVMO is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is SAC57D53MCVMO original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for SAC57D53MCVMO, please note this in your RFQ.

Can you provide a datasheet or technical support for SAC57D53MCVMO? ▼

Yes. You can view or download the SAC57D53MCVMO.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for SAC57D53MCVMO, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for SAC57D53MCVMO? ▼

Yes. Based on your application, preferred manufacturer, package 516-BGA, electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for SAC57D53MCVMO. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use SAC57D53MCVMO? ▼

As a Embedded - Microcontrollers product from NXP USA Inc., SAC57D53MCVMO may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.