SAK-C868-1SR BA Infineon Technologies

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Part No.:: SAK-C868-1SR BA

Manufacturer:: Infineon Technologies

Category:: Embedded - Microcontrollers

Package:: 38-TFSOP (0.173", 4.40mm Width)

Datasheet:: SAK-C868-1SR BA.pdf

Description:: IC MCU 8BIT 8KB RAM 38TSSOP

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Application Scenarios

What Applications Is SAK-C868-1SR BA Suitable For?

SAK-C868-1SR BA is a Embedded - Microcontrollers product from Infineon Technologies, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Embedded - Microcontrollers components. Engineers can review the SAK-C868-1SR BA datasheet, package 38-TFSOP (0.173", 4.40mm Width) and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original Infineon Technologies components are required, helping engineers evaluate SAK-C868-1SR BA specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the SAK-C868-1SR BA description, package 38-TFSOP (0.173", 4.40mm Width) and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports SAK-C868-1SR BA datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for SAK-C868-1SR BA Pricing & Technical Support

Product Overview

SAK-C868-1SR BA is a Embedded - Microcontrollers product from Infineon Technologies. It is supplied in package 38-TFSOP (0.173", 4.40mm Width) and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide SAK-C868-1SR BA datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: IC MCU 8BIT 8KB RAM 38TSSOP

Key Features

Part Number:SAK-C868-1SR BA
Manufacturer:Infineon Technologies
Category:Embedded - Microcontrollers
Package:38-TFSOP (0.173", 4.40mm Width)
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

SAK-C868-1SR BA may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for SAK-C868-1SR BA stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Package/Case:

38-TFSOP (0.173", 4.40mm Width)
Packaging:

Tape & Reel (TR)
Series:

C5xx/C8xx
ProductStatus:

RoHS
CoreProcessor:

40MHz
CoreSize:

512 x 8
Speed:

8-Bit
Connectivity:

-
Peripherals:

Obsolete
NumberofI/O:

Brown-out Detect/Reset, PWM, WDT
ProgramMemorySize:

UART/USART
ProgramMemoryType:

Surface Mount
EEPROMSize:

18
RAMSize:

C800
Voltage-Supply(Vcc/Vdd):

A/D 5x8b
DataConverters:

External
OscillatorType:

8KB (8K x 8)
OperatingTemperature:

RAM
MountingType:

-40°C ~ 125°C (TA)
Category:

Embedded - Microcontrollers
Datasheet:

SAK-C868-1SR BA.pdf

SAK-C868-1SR BA Frequently Asked Questions

Is SAK-C868-1SR BA currently in stock? ▼

FudongIC currently shows 3,195 units of SAK-C868-1SR BA in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for SAK-C868-1SR BA? ▼

The minimum order quantity currently shown for SAK-C868-1SR BA is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is SAK-C868-1SR BA original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for SAK-C868-1SR BA, please note this in your RFQ.

Can you provide a datasheet or technical support for SAK-C868-1SR BA? ▼

Yes. You can view or download the SAK-C868-1SR BA.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for SAK-C868-1SR BA, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for SAK-C868-1SR BA? ▼

Yes. Based on your application, preferred manufacturer, package 38-TFSOP (0.173", 4.40mm Width), electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for SAK-C868-1SR BA. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use SAK-C868-1SR BA? ▼

As a Embedded - Microcontrollers product from Infineon Technologies, SAK-C868-1SR BA may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.