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SIC769ACD-T1-GE3 Vishay Siliconix

Part No.:: SIC769ACD-T1-GE3

Manufacturer:: Vishay Siliconix

Category:: PMIC - Full, Half-Bridge Drivers

Package:: PowerPAK® MLP66-40

Datasheet:: SIC769ACD-T1-GE3.pdf

Description:: IC CTLR PFC STAGE PPAK MLP66-40

Quantity:: RFQ Add to RFQ List Buy Now Add to Cart

Unit Price:Request Quote

Total:Submit an RFQ for pricing

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Application Scenarios

What Applications Is SIC769ACD-T1-GE3 Suitable For?

SIC769ACD-T1-GE3 is a PMIC - Full, Half-Bridge Drivers product from Vishay Siliconix, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable PMIC - Full, Half-Bridge Drivers components. Engineers can review the SIC769ACD-T1-GE3 datasheet, package PowerPAK® MLP66-40 and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original Vishay Siliconix components are required, helping engineers evaluate SIC769ACD-T1-GE3 specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the SIC769ACD-T1-GE3 description, package PowerPAK® MLP66-40 and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports SIC769ACD-T1-GE3 datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for SIC769ACD-T1-GE3 Pricing & Technical Support

Product Overview

SIC769ACD-T1-GE3 is a PMIC - Full, Half-Bridge Drivers product from Vishay Siliconix. It is supplied in package PowerPAK® MLP66-40 and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide SIC769ACD-T1-GE3 datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: IC CTLR PFC STAGE PPAK MLP66-40

Key Features

Part Number:SIC769ACD-T1-GE3
Manufacturer:Vishay Siliconix
Category:PMIC - Full, Half-Bridge Drivers
Package:PowerPAK® MLP66-40
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

SIC769ACD-T1-GE3 may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for SIC769ACD-T1-GE3 stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Packaging:

Tape & Reel (TR),Cut Tape (CT)
Series:

-
ProductStatus:

Obsolete
OutputConfiguration:

Half Bridge
Applications:

Synchronous Buck Converters
Interface:

PWM
LoadType:

Inductive
Technology:

DrMOS
RdsOn(Typ):

1.7mOhm LS, 6mOhm HS
Current-Output/Channel:

35A
Current-PeakOutput:

-
Voltage-Supply:

4.5V ~ 5.5V
Voltage-Load:

3V ~ 16V
OperatingTemperature:

-40°C ~ 150°C (TJ)
Features:

Bootstrap Circuit, Diode Emulation, Status Flag
FaultProtection:

Over Temperature, Shoot-Through, UVLO
MountingType:

Surface Mount
Category:

PMIC - Full, Half-Bridge Drivers
Datasheet:

SIC769ACD-T1-GE3.pdf

SIC769ACD-T1-GE3 Frequently Asked Questions

Is SIC769ACD-T1-GE3 currently in stock? ▼

FudongIC currently shows 3,882 units of SIC769ACD-T1-GE3 in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for SIC769ACD-T1-GE3? ▼

The minimum order quantity currently shown for SIC769ACD-T1-GE3 is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is SIC769ACD-T1-GE3 original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for SIC769ACD-T1-GE3, please note this in your RFQ.

Can you provide a datasheet or technical support for SIC769ACD-T1-GE3? ▼

Yes. You can view or download the SIC769ACD-T1-GE3.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for SIC769ACD-T1-GE3, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for SIC769ACD-T1-GE3? ▼

Yes. Based on your application, preferred manufacturer, package PowerPAK® MLP66-40, electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for SIC769ACD-T1-GE3. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use SIC769ACD-T1-GE3? ▼

As a PMIC - Full, Half-Bridge Drivers product from Vishay Siliconix, SIC769ACD-T1-GE3 may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.