All Categories

View More Product Categories >>

SM470R1B1MHKPS Texas Instruments

Part No.:: SM470R1B1MHKPS

Manufacturer:: Texas Instruments

Category:: Embedded - Microcontrollers

Package:: 84-BFCQFP Exposed Pad

Datasheet:: SM470R1B1MHKPS.pdf

Description:: IC MCU 16/32BIT 1MB FLASH 84CFP

Quantity:: RFQ Add to RFQ List Buy Now Add to Cart

Unit Price:Request Quote

Total:Submit an RFQ for pricing

Payment:

Shipping:

Application Scenarios

What Applications Is SM470R1B1MHKPS Suitable For?

SM470R1B1MHKPS is a Embedded - Microcontrollers product from Texas Instruments, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Embedded - Microcontrollers components. Engineers can review the SM470R1B1MHKPS datasheet, package 84-BFCQFP Exposed Pad and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original Texas Instruments components are required, helping engineers evaluate SM470R1B1MHKPS specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the SM470R1B1MHKPS description, package 84-BFCQFP Exposed Pad and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports SM470R1B1MHKPS datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for SM470R1B1MHKPS Pricing & Technical Support

Product Overview

SM470R1B1MHKPS is a Embedded - Microcontrollers product from Texas Instruments. It is supplied in package 84-BFCQFP Exposed Pad and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide SM470R1B1MHKPS datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: IC MCU 16/32BIT 1MB FLASH 84CFP

Key Features

Part Number:SM470R1B1MHKPS
Manufacturer:Texas Instruments
Category:Embedded - Microcontrollers
Package:84-BFCQFP Exposed Pad
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

SM470R1B1MHKPS may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for SM470R1B1MHKPS stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Package/Case:

84-BFCQFP Exposed Pad
Packaging:

Tray
Series:

TMS470
ProductStatus:

RoHS
CoreProcessor:

60MHz
CoreSize:

64K x 8
Speed:

16/32-Bit
Connectivity:

-
Peripherals:

Active
NumberofI/O:

DMA, POR, PWM, WDT
ProgramMemorySize:

CANbus, I²C, SCI, SPI
ProgramMemoryType:

Surface Mount
EEPROMSize:

46
RAMSize:

ARM7®
Voltage-Supply(Vcc/Vdd):

A/D 12x10b
DataConverters:

External
OscillatorType:

1MB (1M x 8)
OperatingTemperature:

FLASH
MountingType:

-55°C ~ 220°C (TA)
Category:

Embedded - Microcontrollers
Datasheet:

SM470R1B1MHKPS.pdf

SM470R1B1MHKPS Frequently Asked Questions

Is SM470R1B1MHKPS currently in stock? ▼

FudongIC currently shows 188 units of SM470R1B1MHKPS in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for SM470R1B1MHKPS? ▼

The minimum order quantity currently shown for SM470R1B1MHKPS is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is SM470R1B1MHKPS original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for SM470R1B1MHKPS, please note this in your RFQ.

Can you provide a datasheet or technical support for SM470R1B1MHKPS? ▼

Yes. You can view or download the SM470R1B1MHKPS.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for SM470R1B1MHKPS, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for SM470R1B1MHKPS? ▼

Yes. Based on your application, preferred manufacturer, package 84-BFCQFP Exposed Pad, electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for SM470R1B1MHKPS. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use SM470R1B1MHKPS? ▼

As a Embedded - Microcontrollers product from Texas Instruments, SM470R1B1MHKPS may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.