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SP5744CBK1AVKU6R NXP USA Inc.

Part No.:: SP5744CBK1AVKU6R

Manufacturer:: NXP USA Inc.

Category:: Embedded - Microcontrollers

Package:: 176-LQFP Exposed Pad

Datasheet:: SP5744CBK1AVKU6R.pdf

Description:: IC MCU 32BIT 1.5MB FLASH 176LQFP

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Application Scenarios

What Applications Is SP5744CBK1AVKU6R Suitable For?

SP5744CBK1AVKU6R is a Embedded - Microcontrollers product from NXP USA Inc., suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Embedded - Microcontrollers components. Engineers can review the SP5744CBK1AVKU6R datasheet, package 176-LQFP Exposed Pad and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original NXP USA Inc. components are required, helping engineers evaluate SP5744CBK1AVKU6R specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the SP5744CBK1AVKU6R description, package 176-LQFP Exposed Pad and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports SP5744CBK1AVKU6R datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for SP5744CBK1AVKU6R Pricing & Technical Support

Product Overview

SP5744CBK1AVKU6R is a Embedded - Microcontrollers product from NXP USA Inc.. It is supplied in package 176-LQFP Exposed Pad and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide SP5744CBK1AVKU6R datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: IC MCU 32BIT 1.5MB FLASH 176LQFP

Key Features

Part Number:SP5744CBK1AVKU6R
Manufacturer:NXP USA Inc.
Category:Embedded - Microcontrollers
Package:176-LQFP Exposed Pad
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

SP5744CBK1AVKU6R may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for SP5744CBK1AVKU6R stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Package/Case:

176-LQFP Exposed Pad
Packaging:

Tape & Reel (TR)
Series:

MPC57xx
ProductStatus:

RoHS
CoreProcessor:

80MHz, 160MHz
CoreSize:

192K x 8
Speed:

32-Bit Dual-Core
Connectivity:

64K x 8
Peripherals:

Active
NumberofI/O:

DMA, I²S, POR, WDT
ProgramMemorySize:

CANbus, Ethernet, FlexRay, I²C, LINbus, SPI
ProgramMemoryType:

Surface Mount
EEPROMSize:

-
RAMSize:

e200z2, e200z4
Voltage-Supply(Vcc/Vdd):

A/D 36x10b, 16x12b
DataConverters:

Internal
OscillatorType:

1.5MB (1.5M x 8)
OperatingTemperature:

FLASH
MountingType:

-40°C ~ 105°C (TA)
Category:

Embedded - Microcontrollers
Datasheet:

SP5744CBK1AVKU6R.pdf

SP5744CBK1AVKU6R Frequently Asked Questions

Is SP5744CBK1AVKU6R currently in stock? ▼

FudongIC currently shows 2,377 units of SP5744CBK1AVKU6R in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for SP5744CBK1AVKU6R? ▼

The minimum order quantity currently shown for SP5744CBK1AVKU6R is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is SP5744CBK1AVKU6R original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for SP5744CBK1AVKU6R, please note this in your RFQ.

Can you provide a datasheet or technical support for SP5744CBK1AVKU6R? ▼

Yes. You can view or download the SP5744CBK1AVKU6R.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for SP5744CBK1AVKU6R, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for SP5744CBK1AVKU6R? ▼

Yes. Based on your application, preferred manufacturer, package 176-LQFP Exposed Pad, electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for SP5744CBK1AVKU6R. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use SP5744CBK1AVKU6R? ▼

As a Embedded - Microcontrollers product from NXP USA Inc., SP5744CBK1AVKU6R may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.