All Categories

View More Product Categories >>

SPC56EL60L5CBOSY STMicroelectronics

Part No.:: SPC56EL60L5CBOSY

Manufacturer:: STMicroelectronics

Category:: Embedded - Microcontrollers

Package:: 144-LQFP

Datasheet:: SPC56EL60L5CBOSY.pdf

Description:: IC MCU 32BIT 1MB FLASH 144LQFP

Quantity:: RFQ Add to RFQ List Buy Now Add to Cart

Unit Price:Request Quote

Total:Submit an RFQ for pricing

Payment:

Shipping:

Application Scenarios

What Applications Is SPC56EL60L5CBOSY Suitable For?

SPC56EL60L5CBOSY is a Embedded - Microcontrollers product from STMicroelectronics, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Embedded - Microcontrollers components. Engineers can review the SPC56EL60L5CBOSY datasheet, package 144-LQFP and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original STMicroelectronics components are required, helping engineers evaluate SPC56EL60L5CBOSY specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the SPC56EL60L5CBOSY description, package 144-LQFP and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports SPC56EL60L5CBOSY datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for SPC56EL60L5CBOSY Pricing & Technical Support

Product Overview

SPC56EL60L5CBOSY is a Embedded - Microcontrollers product from STMicroelectronics. It is supplied in package 144-LQFP and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide SPC56EL60L5CBOSY datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: IC MCU 32BIT 1MB FLASH 144LQFP

Key Features

Part Number:SPC56EL60L5CBOSY
Manufacturer:STMicroelectronics
Category:Embedded - Microcontrollers
Package:144-LQFP
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

SPC56EL60L5CBOSY may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for SPC56EL60L5CBOSY stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Package/Case:

144-LQFP
Packaging:

Tray
Series:

Automotive, AEC-Q100, SPC56xL
ProductStatus:

RoHS
CoreProcessor:

120MHz
CoreSize:

128K x 8
Speed:

32-Bit Dual-Core
Connectivity:

-
Peripherals:

Active
NumberofI/O:

DMA, LVD, POR, PWM, WDT
ProgramMemorySize:

CANbus, LINbus, SCI, SPI, UART/USART
ProgramMemoryType:

Surface Mount
EEPROMSize:

96
RAMSize:

e200z4d
Voltage-Supply(Vcc/Vdd):

A/D 32x12b
DataConverters:

Internal
OscillatorType:

1MB (1M x 8)
OperatingTemperature:

FLASH
MountingType:

-40°C ~ 125°C (TA)
Category:

Embedded - Microcontrollers
Datasheet:

SPC56EL60L5CBOSY.pdf

SPC56EL60L5CBOSY Frequently Asked Questions

Is SPC56EL60L5CBOSY currently in stock? ▼

FudongIC currently shows 3,672 units of SPC56EL60L5CBOSY in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for SPC56EL60L5CBOSY? ▼

The minimum order quantity currently shown for SPC56EL60L5CBOSY is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is SPC56EL60L5CBOSY original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for SPC56EL60L5CBOSY, please note this in your RFQ.

Can you provide a datasheet or technical support for SPC56EL60L5CBOSY? ▼

Yes. You can view or download the SPC56EL60L5CBOSY.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for SPC56EL60L5CBOSY, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for SPC56EL60L5CBOSY? ▼

Yes. Based on your application, preferred manufacturer, package 144-LQFP, electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for SPC56EL60L5CBOSY. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use SPC56EL60L5CBOSY? ▼

As a Embedded - Microcontrollers product from STMicroelectronics, SPC56EL60L5CBOSY may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.