All Categories

View More Product Categories >>

TDA8787AHL/C3,118 NXP USA Inc.

Part No.:: TDA8787AHL/C3,118

Manufacturer:: NXP USA Inc.

Category:: Data Acquisition - ADCs/DACs - Special Purpose

Package:: 48-LQFP

Datasheet:: TDA8787AHL/C3,118.pdf

Description:: IC CCD 10BIT 18M 48LQFP

Quantity:: RFQ Add to RFQ List Buy Now Add to Cart

Unit Price:Request Quote

Total:Submit an RFQ for pricing

Payment:

Shipping:

Application Scenarios

What Applications Is TDA8787AHL/C3,118 Suitable For?

TDA8787AHL/C3,118 is a Data Acquisition - ADCs/DACs - Special Purpose product from NXP USA Inc., suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Data Acquisition - ADCs/DACs - Special Purpose components. Engineers can review the TDA8787AHL/C3,118 datasheet, package 48-LQFP and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original NXP USA Inc. components are required, helping engineers evaluate TDA8787AHL/C3,118 specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the TDA8787AHL/C3,118 description, package 48-LQFP and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports TDA8787AHL/C3,118 datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for TDA8787AHL/C3,118 Pricing & Technical Support

Product Overview

TDA8787AHL/C3,118 is a Data Acquisition - ADCs/DACs - Special Purpose product from NXP USA Inc.. It is supplied in package 48-LQFP and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide TDA8787AHL/C3,118 datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: IC CCD 10BIT 18M 48LQFP

Key Features

Part Number:TDA8787AHL/C3,118
Manufacturer:NXP USA Inc.
Category:Data Acquisition - ADCs/DACs - Special Purpose
Package:48-LQFP
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

TDA8787AHL/C3,118 may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for TDA8787AHL/C3,118 stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Package/Case:

48-LQFP
Packaging:

Tape & Reel (TR)
Series:

-
ProductStatus:

Obsolete
Type:

CCD (Charged Coupled Device)
NumberofChannels:

1
Resolution(Bits):

10 b
SamplingRate(PerSecond):

18M
DataInterface:

Parallel
VoltageSupplySource:

Analog and Digital
Voltage-Supply:

2.7V ~ 3.6V
OperatingTemperature:

-20°C ~ 75°C
MountingType:

Surface Mount
Category:

Data Acquisition - ADCs/DACs - Special Purpose
Datasheet:

TDA8787AHL/C3,118.pdf

TDA8787AHL/C3,118 Frequently Asked Questions

Is TDA8787AHL/C3,118 currently in stock? ▼

FudongIC currently shows 3,412 units of TDA8787AHL/C3,118 in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for TDA8787AHL/C3,118? ▼

The minimum order quantity currently shown for TDA8787AHL/C3,118 is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is TDA8787AHL/C3,118 original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for TDA8787AHL/C3,118, please note this in your RFQ.

Can you provide a datasheet or technical support for TDA8787AHL/C3,118? ▼

Yes. You can view or download the TDA8787AHL/C3,118.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for TDA8787AHL/C3,118, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for TDA8787AHL/C3,118? ▼

Yes. Based on your application, preferred manufacturer, package 48-LQFP, electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for TDA8787AHL/C3,118. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use TDA8787AHL/C3,118? ▼

As a Data Acquisition - ADCs/DACs - Special Purpose product from NXP USA Inc., TDA8787AHL/C3,118 may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.