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THS6062IDGN Texas Instruments

Part No.:: THS6062IDGN

Manufacturer:: Texas Instruments

Category:: Interface - Drivers, Receivers, Transceivers

Package:: 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) Exposed Pad

Datasheet:: THS6062IDGN.pdf

Description:: IC RECEIVER FULL 0/2 8MSOP

Quantity:: RFQ Add to RFQ List Buy Now Add to Cart

Unit Price:Request Quote

Total:Submit an RFQ for pricing

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Application Scenarios

What Applications Is THS6062IDGN Suitable For?

THS6062IDGN is a Interface - Drivers, Receivers, Transceivers product from Texas Instruments, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Interface - Drivers, Receivers, Transceivers components. Engineers can review the THS6062IDGN datasheet, package 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) Exposed Pad and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original Texas Instruments components are required, helping engineers evaluate THS6062IDGN specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the THS6062IDGN description, package 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) Exposed Pad and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports THS6062IDGN datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for THS6062IDGN Pricing & Technical Support

Product Overview

THS6062IDGN is a Interface - Drivers, Receivers, Transceivers product from Texas Instruments. It is supplied in package 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) Exposed Pad and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide THS6062IDGN datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: IC RECEIVER FULL 0/2 8MSOP

Key Features

Part Number:THS6062IDGN
Manufacturer:Texas Instruments
Category:Interface - Drivers, Receivers, Transceivers
Package:8-TSSOP, 8-MSOP (0.118, 3.00mm Width) Exposed Pad
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

THS6062IDGN may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for THS6062IDGN stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Package/Case:

8-TSSOP, 8-MSOP (0.118, 3.00mm Width) Exposed Pad
Packaging:

Tube,Tube
Series:

-
ProductStatus:

Discontinued at Mosen
Type:

Receiver
Protocol:

DSL
NumberofDrivers/Receivers:

0/2
Duplex:

Full
ReceiverHysteresis:

-
DataRate:

-
Voltage-Supply:

5V ~ 15V
OperatingTemperature:

-40°C ~ 85°C
MountingType:

Surface Mount
Category:

Interface - Drivers, Receivers, Transceivers
Datasheet:

THS6062IDGN.pdf

THS6062IDGN Frequently Asked Questions

Is THS6062IDGN currently in stock? ▼

FudongIC currently shows 19,077 units of THS6062IDGN in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for THS6062IDGN? ▼

The minimum order quantity currently shown for THS6062IDGN is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is THS6062IDGN original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for THS6062IDGN, please note this in your RFQ.

Can you provide a datasheet or technical support for THS6062IDGN? ▼

Yes. You can view or download the THS6062IDGN.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for THS6062IDGN, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for THS6062IDGN? ▼

Yes. Based on your application, preferred manufacturer, package 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) Exposed Pad, electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for THS6062IDGN. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use THS6062IDGN? ▼

As a Interface - Drivers, Receivers, Transceivers product from Texas Instruments, THS6062IDGN may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.