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TLC2274ID Texas Instruments

Part No.:: TLC2274ID

Manufacturer:: Texas Instruments

Category:: Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps

Package:: 14-SOIC (0.154, 3.90mm Width)

Datasheet:: TLC2274ID.pdf

Description:: IC OPAMP GP 4 CIRCUIT 14SOIC

Quantity:: RFQ Add to RFQ List Buy Now Add to Cart

Unit Price:Request Quote

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Application Scenarios

What Applications Is TLC2274ID Suitable For?

TLC2274ID is a Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps product from Texas Instruments, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps components. Engineers can review the TLC2274ID datasheet, package 14-SOIC (0.154, 3.90mm Width) and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original Texas Instruments components are required, helping engineers evaluate TLC2274ID specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the TLC2274ID description, package 14-SOIC (0.154, 3.90mm Width) and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports TLC2274ID datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for TLC2274ID Pricing & Technical Support

Product Overview

TLC2274ID is a Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps product from Texas Instruments. It is supplied in package 14-SOIC (0.154, 3.90mm Width) and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide TLC2274ID datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: IC OPAMP GP 4 CIRCUIT 14SOIC

Key Features

Part Number:TLC2274ID
Manufacturer:Texas Instruments
Category:Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps
Package:14-SOIC (0.154, 3.90mm Width)
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

TLC2274ID may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for TLC2274ID stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Package/Case:

14-SOIC (0.154, 3.90mm Width)
Packaging:

Tube
Series:

-
ProductStatus:

Active
AmplifierType:

General Purpose
NumberofCircuits:

4
OutputType:

Rail-to-Rail
SlewRate:

3.6V/µs
GainBandwidthProduct:

2.25 MHz
-3dbBandwidth:

-
Current-InputBias:

1 pA
Voltage-InputOffset:

300 µV
Current-Supply:

4.8mA (x4 Channels)
Current-Output/Channel:

50 mA
Voltage-SupplySpan(Min):

4.4 V
Voltage-SupplySpan(Max):

16 V
OperatingTemperature:

-40°C ~ 125°C (TA)
MountingType:

Surface Mount
Category:

Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps
Datasheet:

TLC2274ID.pdf

TLC2274ID Frequently Asked Questions

Is TLC2274ID currently in stock? ▼

FudongIC currently shows 40,850 units of TLC2274ID in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for TLC2274ID? ▼

The minimum order quantity currently shown for TLC2274ID is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is TLC2274ID original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for TLC2274ID, please note this in your RFQ.

Can you provide a datasheet or technical support for TLC2274ID? ▼

Yes. You can view or download the TLC2274ID.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for TLC2274ID, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for TLC2274ID? ▼

Yes. Based on your application, preferred manufacturer, package 14-SOIC (0.154, 3.90mm Width), electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for TLC2274ID. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use TLC2274ID? ▼

As a Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps product from Texas Instruments, TLC2274ID may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.