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TLE9254SKXUMA1 Infineon Technologies

Part No.:: TLE9254SKXUMA1

Manufacturer:: Infineon Technologies

Category:: Interface - Drivers, Receivers, Transceivers

Package:: 14-SOIC (0.154, 3.90mm Width)

Datasheet:: TLE9254SKXUMA1.pdf

Description:: IC CAN TRANSCEIVER 14--DSO

Quantity:: RFQ Add to RFQ List Buy Now Add to Cart

Unit Price:Request Quote

Total:Submit an RFQ for pricing

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Application Scenarios

What Applications Is TLE9254SKXUMA1 Suitable For?

TLE9254SKXUMA1 is a Interface - Drivers, Receivers, Transceivers product from Infineon Technologies, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Interface - Drivers, Receivers, Transceivers components. Engineers can review the TLE9254SKXUMA1 datasheet, package 14-SOIC (0.154, 3.90mm Width) and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original Infineon Technologies components are required, helping engineers evaluate TLE9254SKXUMA1 specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the TLE9254SKXUMA1 description, package 14-SOIC (0.154, 3.90mm Width) and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports TLE9254SKXUMA1 datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for TLE9254SKXUMA1 Pricing & Technical Support

Product Overview

TLE9254SKXUMA1 is a Interface - Drivers, Receivers, Transceivers product from Infineon Technologies. It is supplied in package 14-SOIC (0.154, 3.90mm Width) and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide TLE9254SKXUMA1 datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: IC CAN TRANSCEIVER 14--DSO

Key Features

Part Number:TLE9254SKXUMA1
Manufacturer:Infineon Technologies
Category:Interface - Drivers, Receivers, Transceivers
Package:14-SOIC (0.154, 3.90mm Width)
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

TLE9254SKXUMA1 may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for TLE9254SKXUMA1 stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Package/Case:

14-SOIC (0.154, 3.90mm Width)
Packaging:

Tape & Reel (TR)
Series:

Automotive, AEC-Q100
ProductStatus:

Obsolete
Type:

Transceiver
Protocol:

CAN
NumberofDrivers/Receivers:

2/2
Duplex:

Half
ReceiverHysteresis:

50 mV
DataRate:

5Mbps
Voltage-Supply:

4.5V ~ 5.5V
OperatingTemperature:

-40°C ~ 150°C (TJ)
MountingType:

Surface Mount
Category:

Interface - Drivers, Receivers, Transceivers
Datasheet:

TLE9254SKXUMA1.pdf

TLE9254SKXUMA1 Frequently Asked Questions

Is TLE9254SKXUMA1 currently in stock? ▼

FudongIC currently shows 3,970 units of TLE9254SKXUMA1 in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for TLE9254SKXUMA1? ▼

The minimum order quantity currently shown for TLE9254SKXUMA1 is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is TLE9254SKXUMA1 original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for TLE9254SKXUMA1, please note this in your RFQ.

Can you provide a datasheet or technical support for TLE9254SKXUMA1? ▼

Yes. You can view or download the TLE9254SKXUMA1.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for TLE9254SKXUMA1, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for TLE9254SKXUMA1? ▼

Yes. Based on your application, preferred manufacturer, package 14-SOIC (0.154, 3.90mm Width), electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for TLE9254SKXUMA1. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use TLE9254SKXUMA1? ▼

As a Interface - Drivers, Receivers, Transceivers product from Infineon Technologies, TLE9254SKXUMA1 may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.