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TLP227GA-2(TP1,F) Toshiba Semiconductor and Storage

Part No.:: TLP227GA-2(TP1,F)

Manufacturer:: Toshiba Semiconductor and Storage

Category:: Solid State Relays

Package:: 8-SMD, Gull Wing

Datasheet:: TLP227GA-2(TP1,F).pdf

Description:: SSR RELAY SPST-NO 120MA 0-400V

Quantity:: RFQ Add to RFQ List Buy Now Add to Cart

Unit Price:Request Quote

Total:Submit an RFQ for pricing

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Application Scenarios

What Applications Is TLP227GA-2(TP1,F) Suitable For?

TLP227GA-2(TP1,F) is a Solid State Relays product from Toshiba Semiconductor and Storage, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Solid State Relays components. Engineers can review the TLP227GA-2(TP1,F) datasheet, package 8-SMD, Gull Wing and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original Toshiba Semiconductor and Storage components are required, helping engineers evaluate TLP227GA-2(TP1,F) specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the TLP227GA-2(TP1,F) description, package 8-SMD, Gull Wing and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports TLP227GA-2(TP1,F) datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for TLP227GA-2(TP1,F) Pricing & Technical Support

Product Overview

TLP227GA-2(TP1,F) is a Solid State Relays product from Toshiba Semiconductor and Storage. It is supplied in package 8-SMD, Gull Wing and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide TLP227GA-2(TP1,F) datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: SSR RELAY SPST-NO 120MA 0-400V

Key Features

Part Number:TLP227GA-2(TP1,F)
Manufacturer:Toshiba Semiconductor and Storage
Category:Solid State Relays
Package:8-SMD, Gull Wing
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

TLP227GA-2(TP1,F) may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for TLP227GA-2(TP1,F) stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Package/Case:

8-SMD, Gull Wing
Packaging:

Tape & Reel (TR),Cut Tape (CT)
Series:

TLP227GA-2
ProductStatus:

Obsolete
MountingType:

Surface Mount
Circuit:

SPST-NO (1 Form A) x 2
OutputType:

AC, DC
Voltage-Input:

1.15VDC
Voltage-Load:

0 V ~ 400 V
LoadCurrent:

120 mA
On-StateResistance(Max):

35 Ohms
TerminationStyle:

Gull Wing
Category:

Solid State Relays
Datasheet:

TLP227GA-2(TP1,F).pdf

TLP227GA-2(TP1,F) Frequently Asked Questions

Is TLP227GA-2(TP1,F) currently in stock? ▼

FudongIC currently shows 2,565 units of TLP227GA-2(TP1,F) in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for TLP227GA-2(TP1,F)? ▼

The minimum order quantity currently shown for TLP227GA-2(TP1,F) is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is TLP227GA-2(TP1,F) original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for TLP227GA-2(TP1,F), please note this in your RFQ.

Can you provide a datasheet or technical support for TLP227GA-2(TP1,F)? ▼

Yes. You can view or download the TLP227GA-2(TP1,F).pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for TLP227GA-2(TP1,F), you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for TLP227GA-2(TP1,F)? ▼

Yes. Based on your application, preferred manufacturer, package 8-SMD, Gull Wing, electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for TLP227GA-2(TP1,F). Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use TLP227GA-2(TP1,F)? ▼

As a Solid State Relays product from Toshiba Semiconductor and Storage, TLP227GA-2(TP1,F) may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.