All Categories

View More Product Categories >>

TMP007AIYZFR Texas Instruments

Part No.:: TMP007AIYZFR

Manufacturer:: Texas Instruments

Category:: Temperature Sensors - Analog and Digital Output

Package:: 8-UFBGA, DSBGA

Datasheet:: TMP007AIYZFR.pdf

Description:: SENSOR DIGITAL -40C-125C 8DSBGA

Quantity:: RFQ Add to RFQ List Buy Now Add to Cart

Unit Price:Request Quote

Total:Submit an RFQ for pricing

Payment:

Shipping:

Application Scenarios

What Applications Is TMP007AIYZFR Suitable For?

TMP007AIYZFR is a Temperature Sensors - Analog and Digital Output product from Texas Instruments, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Temperature Sensors - Analog and Digital Output components. Engineers can review the TMP007AIYZFR datasheet, package 8-UFBGA, DSBGA and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original Texas Instruments components are required, helping engineers evaluate TMP007AIYZFR specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the TMP007AIYZFR description, package 8-UFBGA, DSBGA and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports TMP007AIYZFR datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for TMP007AIYZFR Pricing & Technical Support

Product Overview

TMP007AIYZFR is a Temperature Sensors - Analog and Digital Output product from Texas Instruments. It is supplied in package 8-UFBGA, DSBGA and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide TMP007AIYZFR datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: SENSOR DIGITAL -40C-125C 8DSBGA

Key Features

Part Number:TMP007AIYZFR
Manufacturer:Texas Instruments
Category:Temperature Sensors - Analog and Digital Output
Package:8-UFBGA, DSBGA
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

TMP007AIYZFR may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for TMP007AIYZFR stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Packaging:

Tape & Reel (TR),Cut Tape (CT)
Series:

-
ProductStatus:

Obsolete
SensorType:

Digital, Infrared (IR)
SensingTemperature-Local:

-40°C ~ 125°C
SensingTemperature-Remote:

-
OutputType:

I²C/SMBus
Voltage-Supply:

2.5V ~ 5.5V
Resolution:

14 b
Features:

One-Shot, Output Switch, Shutdown Mode
Accuracy-Highest(Lowest):

±1°C
TestCondition:

-40°C ~ 125°C
OperatingTemperature:

-40°C ~ 125°C
MountingType:

Surface Mount
Category:

Temperature Sensors - Analog and Digital Output
Datasheet:

TMP007AIYZFR.pdf

TMP007AIYZFR Frequently Asked Questions

Is TMP007AIYZFR currently in stock? ▼

FudongIC currently shows 3,491 units of TMP007AIYZFR in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for TMP007AIYZFR? ▼

The minimum order quantity currently shown for TMP007AIYZFR is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is TMP007AIYZFR original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for TMP007AIYZFR, please note this in your RFQ.

Can you provide a datasheet or technical support for TMP007AIYZFR? ▼

Yes. You can view or download the TMP007AIYZFR.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for TMP007AIYZFR, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for TMP007AIYZFR? ▼

Yes. Based on your application, preferred manufacturer, package 8-UFBGA, DSBGA, electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for TMP007AIYZFR. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use TMP007AIYZFR? ▼

As a Temperature Sensors - Analog and Digital Output product from Texas Instruments, TMP007AIYZFR may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.