All Categories

View More Product Categories >>

TMP117MAIDRVT Texas Instruments

Part No.:: TMP117MAIDRVT

Manufacturer:: Texas Instruments

Category:: Temperature Sensors - Analog and Digital Output

Package:: 6-WDFN Exposed Pad

Datasheet:: TMP117MAIDRVT.pdf

Description:: SENSOR TEMP

Quantity:: RFQ Add to RFQ List Buy Now Add to Cart

Unit Price:Request Quote

Total:Submit an RFQ for pricing

Payment:

Shipping:

Application Scenarios

What Applications Is TMP117MAIDRVT Suitable For?

TMP117MAIDRVT is a Temperature Sensors - Analog and Digital Output product from Texas Instruments, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Temperature Sensors - Analog and Digital Output components. Engineers can review the TMP117MAIDRVT datasheet, package 6-WDFN Exposed Pad and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original Texas Instruments components are required, helping engineers evaluate TMP117MAIDRVT specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the TMP117MAIDRVT description, package 6-WDFN Exposed Pad and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports TMP117MAIDRVT datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for TMP117MAIDRVT Pricing & Technical Support

Product Overview

TMP117MAIDRVT is a Temperature Sensors - Analog and Digital Output product from Texas Instruments. It is supplied in package 6-WDFN Exposed Pad and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide TMP117MAIDRVT datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: SENSOR TEMP

Key Features

Part Number:TMP117MAIDRVT
Manufacturer:Texas Instruments
Category:Temperature Sensors - Analog and Digital Output
Package:6-WDFN Exposed Pad
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

TMP117MAIDRVT may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for TMP117MAIDRVT stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Packaging:

Tape & Reel (TR),Cut Tape (CT)
Series:

-
ProductStatus:

Active
SensorType:

Digital, Local
SensingTemperature-Local:

0°C ~ 85°C
SensingTemperature-Remote:

-
OutputType:

I²C/SMBus
Voltage-Supply:

1.8V ~ 5.5V
Resolution:

16 b
Features:

Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Accuracy-Highest(Lowest):

±0.1°C (±0.2°C)
TestCondition:

30°C ~ 45°C (0°C ~ 85°C)
OperatingTemperature:

0°C ~ 85°C
MountingType:

Surface Mount
Category:

Temperature Sensors - Analog and Digital Output
Datasheet:

TMP117MAIDRVT.pdf

TMP117MAIDRVT Frequently Asked Questions

Is TMP117MAIDRVT currently in stock? ▼

FudongIC currently shows 2,323 units of TMP117MAIDRVT in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for TMP117MAIDRVT? ▼

The minimum order quantity currently shown for TMP117MAIDRVT is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is TMP117MAIDRVT original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for TMP117MAIDRVT, please note this in your RFQ.

Can you provide a datasheet or technical support for TMP117MAIDRVT? ▼

Yes. You can view or download the TMP117MAIDRVT.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for TMP117MAIDRVT, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for TMP117MAIDRVT? ▼

Yes. Based on your application, preferred manufacturer, package 6-WDFN Exposed Pad, electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for TMP117MAIDRVT. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use TMP117MAIDRVT? ▼

As a Temperature Sensors - Analog and Digital Output product from Texas Instruments, TMP117MAIDRVT may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.