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TMP75BQDGKTQ1 Texas Instruments

Part No.:: TMP75BQDGKTQ1

Manufacturer:: Texas Instruments

Category:: Temperature Sensors - Analog and Digital Output

Package:: 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)

Datasheet:: TMP75BQDGKTQ1.pdf

Description:: SENSOR DIGITAL -40C-125C 8VSSOP

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Application Scenarios

What Applications Is TMP75BQDGKTQ1 Suitable For?

TMP75BQDGKTQ1 is a Temperature Sensors - Analog and Digital Output product from Texas Instruments, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Temperature Sensors - Analog and Digital Output components. Engineers can review the TMP75BQDGKTQ1 datasheet, package 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original Texas Instruments components are required, helping engineers evaluate TMP75BQDGKTQ1 specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the TMP75BQDGKTQ1 description, package 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports TMP75BQDGKTQ1 datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for TMP75BQDGKTQ1 Pricing & Technical Support

Product Overview

TMP75BQDGKTQ1 is a Temperature Sensors - Analog and Digital Output product from Texas Instruments. It is supplied in package 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide TMP75BQDGKTQ1 datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: SENSOR DIGITAL -40C-125C 8VSSOP

Key Features

Part Number:TMP75BQDGKTQ1
Manufacturer:Texas Instruments
Category:Temperature Sensors - Analog and Digital Output
Package:8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

TMP75BQDGKTQ1 may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for TMP75BQDGKTQ1 stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Packaging:

Tape & Reel (TR),Cut Tape (CT),Bulk
Series:

Automotive, AEC-Q100
ProductStatus:

Active
SensorType:

Digital, Local
SensingTemperature-Local:

-40°C ~ 125°C
SensingTemperature-Remote:

-
OutputType:

SMBus
Voltage-Supply:

1.4V ~ 3.6V
Resolution:

11 b
Features:

One-Shot, Output Switch, Programmable Limit, Shutdown Mode
Accuracy-Highest(Lowest):

±2°C (±3°C)
TestCondition:

-20°C ~ 85°C (-40°C ~ 125°C)
OperatingTemperature:

-40°C ~ 125°C
MountingType:

Surface Mount
Category:

Temperature Sensors - Analog and Digital Output
Datasheet:

TMP75BQDGKTQ1.pdf

TMP75BQDGKTQ1 Frequently Asked Questions

Is TMP75BQDGKTQ1 currently in stock? ▼

FudongIC currently shows 2,963 units of TMP75BQDGKTQ1 in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for TMP75BQDGKTQ1? ▼

The minimum order quantity currently shown for TMP75BQDGKTQ1 is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is TMP75BQDGKTQ1 original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for TMP75BQDGKTQ1, please note this in your RFQ.

Can you provide a datasheet or technical support for TMP75BQDGKTQ1? ▼

Yes. You can view or download the TMP75BQDGKTQ1.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for TMP75BQDGKTQ1, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for TMP75BQDGKTQ1? ▼

Yes. Based on your application, preferred manufacturer, package 8-TSSOP, 8-MSOP (0.118, 3.00mm Width), electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for TMP75BQDGKTQ1. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use TMP75BQDGKTQ1? ▼

As a Temperature Sensors - Analog and Digital Output product from Texas Instruments, TMP75BQDGKTQ1 may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.