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TPCP8901(TE85L,F,M Toshiba Semiconductor and Storage

Part No.:: TPCP8901(TE85L,F,M

Manufacturer:: Toshiba Semiconductor and Storage

Category:: Transistors - Bipolar (BJT) - Arrays

Package:: 8-SMD, Flat Lead

Datasheet:: TPCP8901(TE85L,F,M.pdf

Description:: X35 PB-F POWER MOSFET TRANSISTOR

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Application Scenarios

What Applications Is TPCP8901(TE85L,F,M Suitable For?

TPCP8901(TE85L,F,M is a Transistors - Bipolar (BJT) - Arrays product from Toshiba Semiconductor and Storage, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Transistors - Bipolar (BJT) - Arrays components. Engineers can review the TPCP8901(TE85L,F,M datasheet, package 8-SMD, Flat Lead and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original Toshiba Semiconductor and Storage components are required, helping engineers evaluate TPCP8901(TE85L,F,M specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the TPCP8901(TE85L,F,M description, package 8-SMD, Flat Lead and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports TPCP8901(TE85L,F,M datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for TPCP8901(TE85L,F,M Pricing & Technical Support

Product Overview

TPCP8901(TE85L,F,M is a Transistors - Bipolar (BJT) - Arrays product from Toshiba Semiconductor and Storage. It is supplied in package 8-SMD, Flat Lead and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide TPCP8901(TE85L,F,M datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: X35 PB-F POWER MOSFET TRANSISTOR

Key Features

Part Number:TPCP8901(TE85L,F,M
Manufacturer:Toshiba Semiconductor and Storage
Category:Transistors - Bipolar (BJT) - Arrays
Package:8-SMD, Flat Lead
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

TPCP8901(TE85L,F,M may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for TPCP8901(TE85L,F,M stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Packaging:

Tape & Reel (TR)
Series:

-
ProductStatus:

Obsolete
TransistorType:

NPN, PNP
Current-Collector(Ic)(Max):

1A, 800mA
Voltage-CollectorEmitterBreakdown(Max):

50V
VceSaturation(Max)@IbIc:

170mV @ 6mA, 300mA, 200mV @ 10mA, 300mA
Current-CollectorCutoff(Max):

100nA (ICBO)
DCCurrentGain(hFE)(Min)@IcVce:

400 @ 100mA, 2V / 200 @ 100mA, 2V
Power-Max:

1.48W
Frequency-Transition:

-
OperatingTemperature:

150°C (TJ)
MountingType:

Surface Mount
Category:

Transistors - Bipolar (BJT) - Arrays
Datasheet:

TPCP8901(TE85L,F,M.pdf

TPCP8901(TE85L,F,M Frequently Asked Questions

Is TPCP8901(TE85L,F,M currently in stock? ▼

FudongIC currently shows 2,500 units of TPCP8901(TE85L,F,M in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for TPCP8901(TE85L,F,M? ▼

The minimum order quantity currently shown for TPCP8901(TE85L,F,M is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is TPCP8901(TE85L,F,M original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for TPCP8901(TE85L,F,M, please note this in your RFQ.

Can you provide a datasheet or technical support for TPCP8901(TE85L,F,M? ▼

Yes. You can view or download the TPCP8901(TE85L,F,M.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for TPCP8901(TE85L,F,M, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for TPCP8901(TE85L,F,M? ▼

Yes. Based on your application, preferred manufacturer, package 8-SMD, Flat Lead, electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for TPCP8901(TE85L,F,M. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use TPCP8901(TE85L,F,M? ▼

As a Transistors - Bipolar (BJT) - Arrays product from Toshiba Semiconductor and Storage, TPCP8901(TE85L,F,M may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.