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TPW3R70APL,L1Q Toshiba Semiconductor and Storage

Part No.:: TPW3R70APL,L1Q

Manufacturer:: Toshiba Semiconductor and Storage

Category:: Transistors - FETs, MOSFETs - Single

Package:: 8-DSOP Advance

Datasheet:: TPW3R70APL,L1Q.pdf

Description:: PB-F POWER MOSFET TRANSISTOR DSO

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Application Scenarios

What Applications Is TPW3R70APL,L1Q Suitable For?

TPW3R70APL,L1Q is a Transistors - FETs, MOSFETs - Single product from Toshiba Semiconductor and Storage, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Transistors - FETs, MOSFETs - Single components. Engineers can review the TPW3R70APL,L1Q datasheet, package 8-DSOP Advance and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original Toshiba Semiconductor and Storage components are required, helping engineers evaluate TPW3R70APL,L1Q specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the TPW3R70APL,L1Q description, package 8-DSOP Advance and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports TPW3R70APL,L1Q datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for TPW3R70APL,L1Q Pricing & Technical Support

Product Overview

TPW3R70APL,L1Q is a Transistors - FETs, MOSFETs - Single product from Toshiba Semiconductor and Storage. It is supplied in package 8-DSOP Advance and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide TPW3R70APL,L1Q datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: PB-F POWER MOSFET TRANSISTOR DSO

Key Features

Part Number:TPW3R70APL,L1Q
Manufacturer:Toshiba Semiconductor and Storage
Category:Transistors - FETs, MOSFETs - Single
Package:8-DSOP Advance
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

TPW3R70APL,L1Q may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for TPW3R70APL,L1Q stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Packaging:

Tape & Reel (TR)
Series:

U-MOSIX-H
ProductStatus:

Active
FETType:

N-Channel
Technology:

MOSFET (Metal Oxide)
DraintoSourceVoltage(Vdss):

100 V
Current-ContinuousDrain(Id)@25°C:

90A (Tc)
DriveVoltage(MaxRdsOnMinRdsOn):

4.5V, 10V
RdsOn(Max)@IdVgs:

3.7mOhm @ 45A, 10V
Vgs(th)(Max)@Id:

2.5V @ 1mA
GateCharge(Qg)(Max)@Vgs:

67 nC @ 10 V
Vgs(Max):

±20V
InputCapacitance(Ciss)(Max)@Vds:

6300 pF @ 50 V
FETFeature:

-
PowerDissipation(Max):

960mW (Ta), 170W (Tc)
OperatingTemperature:

175°C
MountingType:

Surface Mount
Category:

Transistors - FETs, MOSFETs - Single
Datasheet:

TPW3R70APL,L1Q.pdf

TPW3R70APL,L1Q Frequently Asked Questions

Is TPW3R70APL,L1Q currently in stock? ▼

FudongIC currently shows 2,826 units of TPW3R70APL,L1Q in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for TPW3R70APL,L1Q? ▼

The minimum order quantity currently shown for TPW3R70APL,L1Q is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is TPW3R70APL,L1Q original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for TPW3R70APL,L1Q, please note this in your RFQ.

Can you provide a datasheet or technical support for TPW3R70APL,L1Q? ▼

Yes. You can view or download the TPW3R70APL,L1Q.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for TPW3R70APL,L1Q, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for TPW3R70APL,L1Q? ▼

Yes. Based on your application, preferred manufacturer, package 8-DSOP Advance, electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for TPW3R70APL,L1Q. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use TPW3R70APL,L1Q? ▼

As a Transistors - FETs, MOSFETs - Single product from Toshiba Semiconductor and Storage, TPW3R70APL,L1Q may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.