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TSCSANN250MGUCV Honeywell Sensing and Productivity Solutions

Part No.:: TSCSANN250MGUCV

Manufacturer:: Honeywell Sensing and Productivity Solutions

Category:: Pressure Sensors, Transducers

Package:: 4-SIP, Side Port

Datasheet:: TSCSANN250MGUCV.pdf

Description:: BRD MNT PRESSURE SENSORS

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Application Scenarios

What Applications Is TSCSANN250MGUCV Suitable For?

TSCSANN250MGUCV is a Pressure Sensors, Transducers product from Honeywell Sensing and Productivity Solutions, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Pressure Sensors, Transducers components. Engineers can review the TSCSANN250MGUCV datasheet, package 4-SIP, Side Port and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original Honeywell Sensing and Productivity Solutions components are required, helping engineers evaluate TSCSANN250MGUCV specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the TSCSANN250MGUCV description, package 4-SIP, Side Port and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports TSCSANN250MGUCV datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for TSCSANN250MGUCV Pricing & Technical Support

Product Overview

TSCSANN250MGUCV is a Pressure Sensors, Transducers product from Honeywell Sensing and Productivity Solutions. It is supplied in package 4-SIP, Side Port and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide TSCSANN250MGUCV datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: BRD MNT PRESSURE SENSORS

Key Features

Part Number:TSCSANN250MGUCV
Manufacturer:Honeywell Sensing and Productivity Solutions
Category:Pressure Sensors, Transducers
Package:4-SIP, Side Port
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

TSCSANN250MGUCV may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for TSCSANN250MGUCV stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Package/Case:

4-SIP, Side Port
Packaging:

Bulk
Series:

TruStability® TSC
ProductStatus:

Active
Applications:

Board Mount
PressureType:

Vented Gauge
OperatingPressure:

3.63PSI (25kPa)
OutputType:

Wheatstone Bridge
Output:

0 mV ~ 18.25 mV (5V)
Accuracy:

±0.15%
Voltage-Supply:

1.5V ~ 12V
PortSize:

Male - 0.19 (4.93mm) Tube
PortStyle:

Barbed
Features:

Temperature Compensated
TerminationStyle:

PC Pin
MaximumPressure:

29.01PSI (200kPa)
OperatingTemperature:

-40°C ~ 85°C
Category:

Pressure Sensors, Transducers
Datasheet:

TSCSANN250MGUCV.pdf

TSCSANN250MGUCV Frequently Asked Questions

Is TSCSANN250MGUCV currently in stock? ▼

FudongIC currently shows 3,939 units of TSCSANN250MGUCV in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for TSCSANN250MGUCV? ▼

The minimum order quantity currently shown for TSCSANN250MGUCV is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is TSCSANN250MGUCV original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for TSCSANN250MGUCV, please note this in your RFQ.

Can you provide a datasheet or technical support for TSCSANN250MGUCV? ▼

Yes. You can view or download the TSCSANN250MGUCV.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for TSCSANN250MGUCV, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for TSCSANN250MGUCV? ▼

Yes. Based on your application, preferred manufacturer, package 4-SIP, Side Port, electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for TSCSANN250MGUCV. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use TSCSANN250MGUCV? ▼

As a Pressure Sensors, Transducers product from Honeywell Sensing and Productivity Solutions, TSCSANN250MGUCV may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.