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TSCSNNN100PGUCV Honeywell Sensing and Productivity Solutions

Part No.:: TSCSNNN100PGUCV

Manufacturer:: Honeywell Sensing and Productivity Solutions

Category:: Pressure Sensors, Transducers

Package:: 4-SIP Module

Datasheet:: TSCSNNN100PGUCV.pdf

Description:: BRD MNT PRESSURE SENSORS

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Application Scenarios

What Applications Is TSCSNNN100PGUCV Suitable For?

TSCSNNN100PGUCV is a Pressure Sensors, Transducers product from Honeywell Sensing and Productivity Solutions, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Pressure Sensors, Transducers components. Engineers can review the TSCSNNN100PGUCV datasheet, package 4-SIP Module and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original Honeywell Sensing and Productivity Solutions components are required, helping engineers evaluate TSCSNNN100PGUCV specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the TSCSNNN100PGUCV description, package 4-SIP Module and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports TSCSNNN100PGUCV datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for TSCSNNN100PGUCV Pricing & Technical Support

Product Overview

TSCSNNN100PGUCV is a Pressure Sensors, Transducers product from Honeywell Sensing and Productivity Solutions. It is supplied in package 4-SIP Module and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide TSCSNNN100PGUCV datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: BRD MNT PRESSURE SENSORS

Key Features

Part Number:TSCSNNN100PGUCV
Manufacturer:Honeywell Sensing and Productivity Solutions
Category:Pressure Sensors, Transducers
Package:4-SIP Module
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

TSCSNNN100PGUCV may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for TSCSNNN100PGUCV stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Package/Case:

4-SIP Module
Packaging:

Bulk
Series:

TruStability® TSC
ProductStatus:

Active
Applications:

Board Mount
PressureType:

Vented Gauge
OperatingPressure:

100PSI (689.48kPa)
OutputType:

Wheatstone Bridge
Output:

0 mV ~ 30.5 mV (5V)
Accuracy:

±0.15%
Voltage-Supply:

1.5V ~ 12V
PortSize:

-
PortStyle:

No Port
Features:

Temperature Compensated
TerminationStyle:

PC Pin
MaximumPressure:

245PSI (1689.22kPa)
OperatingTemperature:

-40°C ~ 85°C
Category:

Pressure Sensors, Transducers
Datasheet:

TSCSNNN100PGUCV.pdf

TSCSNNN100PGUCV Frequently Asked Questions

Is TSCSNNN100PGUCV currently in stock? ▼

FudongIC currently shows 3,188 units of TSCSNNN100PGUCV in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for TSCSNNN100PGUCV? ▼

The minimum order quantity currently shown for TSCSNNN100PGUCV is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is TSCSNNN100PGUCV original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for TSCSNNN100PGUCV, please note this in your RFQ.

Can you provide a datasheet or technical support for TSCSNNN100PGUCV? ▼

Yes. You can view or download the TSCSNNN100PGUCV.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for TSCSNNN100PGUCV, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for TSCSNNN100PGUCV? ▼

Yes. Based on your application, preferred manufacturer, package 4-SIP Module, electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for TSCSNNN100PGUCV. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use TSCSNNN100PGUCV? ▼

As a Pressure Sensors, Transducers product from Honeywell Sensing and Productivity Solutions, TSCSNNN100PGUCV may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.