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TSIC 306 SOP-8 Innovative Sensor Technology, USA Division

Part No.:: TSIC 306 SOP-8

Manufacturer:: Innovative Sensor Technology, USA Division

Category:: Temperature Sensors - Analog and Digital Output

Package:: 8-SOIC (0.154, 3.90mm Width)

Datasheet:: TSIC 306 SOP-8.pdf

Description:: SOP-8, -50C TO 150C, DIGITAL SIG

Quantity:: RFQ Add to RFQ List Buy Now Add to Cart

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Application Scenarios

What Applications Is TSIC 306 SOP-8 Suitable For?

TSIC 306 SOP-8 is a Temperature Sensors - Analog and Digital Output product from Innovative Sensor Technology, USA Division, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Temperature Sensors - Analog and Digital Output components. Engineers can review the TSIC 306 SOP-8 datasheet, package 8-SOIC (0.154, 3.90mm Width) and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original Innovative Sensor Technology, USA Division components are required, helping engineers evaluate TSIC 306 SOP-8 specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the TSIC 306 SOP-8 description, package 8-SOIC (0.154, 3.90mm Width) and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports TSIC 306 SOP-8 datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for TSIC 306 SOP-8 Pricing & Technical Support

Product Overview

TSIC 306 SOP-8 is a Temperature Sensors - Analog and Digital Output product from Innovative Sensor Technology, USA Division. It is supplied in package 8-SOIC (0.154, 3.90mm Width) and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide TSIC 306 SOP-8 datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: SOP-8, -50C TO 150C, DIGITAL SIG

Key Features

Part Number:TSIC 306 SOP-8
Manufacturer:Innovative Sensor Technology, USA Division
Category:Temperature Sensors - Analog and Digital Output
Package:8-SOIC (0.154, 3.90mm Width)
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

TSIC 306 SOP-8 may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for TSIC 306 SOP-8 stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Packaging:

Bag
Series:

-
ProductStatus:

Active
SensorType:

Analog, Digital
SensingTemperature-Local:

-
SensingTemperature-Remote:

-
OutputType:

-
Voltage-Supply:

2.97V ~ 5.5V
Resolution:

-
Features:

-
Accuracy-Highest(Lowest):

-
TestCondition:

10°C ~ 90°C
OperatingTemperature:

-50°C ~ 150°C
MountingType:

Surface Mount
Category:

Temperature Sensors - Analog and Digital Output
Datasheet:

TSIC 306 SOP-8.pdf

TSIC 306 SOP-8 Frequently Asked Questions

Is TSIC 306 SOP-8 currently in stock? ▼

FudongIC currently shows 3,137 units of TSIC 306 SOP-8 in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for TSIC 306 SOP-8? ▼

The minimum order quantity currently shown for TSIC 306 SOP-8 is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is TSIC 306 SOP-8 original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for TSIC 306 SOP-8, please note this in your RFQ.

Can you provide a datasheet or technical support for TSIC 306 SOP-8? ▼

Yes. You can view or download the TSIC 306 SOP-8.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for TSIC 306 SOP-8, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for TSIC 306 SOP-8? ▼

Yes. Based on your application, preferred manufacturer, package 8-SOIC (0.154, 3.90mm Width), electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for TSIC 306 SOP-8. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use TSIC 306 SOP-8? ▼

As a Temperature Sensors - Analog and Digital Output product from Innovative Sensor Technology, USA Division, TSIC 306 SOP-8 may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.