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TSV358IPT STMicroelectronics

Part No.:: TSV358IPT

Manufacturer:: STMicroelectronics

Category:: Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps

Package:: 8-TSSOP (0.173, 4.40mm Width)

Datasheet:: TSV358IPT.pdf

Description:: IC OPAMP GP 2 CIRCUIT 8TSSOP

Quantity:: RFQ Add to RFQ List Buy Now Add to Cart

Unit Price:Request Quote

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Application Scenarios

What Applications Is TSV358IPT Suitable For?

TSV358IPT is a Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps product from STMicroelectronics, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps components. Engineers can review the TSV358IPT datasheet, package 8-TSSOP (0.173, 4.40mm Width) and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original STMicroelectronics components are required, helping engineers evaluate TSV358IPT specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the TSV358IPT description, package 8-TSSOP (0.173, 4.40mm Width) and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports TSV358IPT datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for TSV358IPT Pricing & Technical Support

Product Overview

TSV358IPT is a Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps product from STMicroelectronics. It is supplied in package 8-TSSOP (0.173, 4.40mm Width) and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide TSV358IPT datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: IC OPAMP GP 2 CIRCUIT 8TSSOP

Key Features

Part Number:TSV358IPT
Manufacturer:STMicroelectronics
Category:Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps
Package:8-TSSOP (0.173, 4.40mm Width)
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

TSV358IPT may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for TSV358IPT stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Package/Case:

8-TSSOP (0.173, 4.40mm Width)
Packaging:

Tape & Reel (TR),Cut Tape (CT)
Series:

Automotive, AEC-Q100
ProductStatus:

Active
AmplifierType:

General Purpose
NumberofCircuits:

2
OutputType:

Rail-to-Rail
SlewRate:

0.6V/µs
GainBandwidthProduct:

1.4 MHz
-3dbBandwidth:

-
Current-InputBias:

70 nA
Voltage-InputOffset:

200 µV
Current-Supply:

500µA
Current-Output/Channel:

80 mA
Voltage-SupplySpan(Min):

2.5 V
Voltage-SupplySpan(Max):

6 V
OperatingTemperature:

-40°C ~ 125°C
MountingType:

Surface Mount
Category:

Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps
Datasheet:

TSV358IPT.pdf

TSV358IPT Frequently Asked Questions

Is TSV358IPT currently in stock? ▼

FudongIC currently shows 2,690 units of TSV358IPT in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for TSV358IPT? ▼

The minimum order quantity currently shown for TSV358IPT is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is TSV358IPT original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for TSV358IPT, please note this in your RFQ.

Can you provide a datasheet or technical support for TSV358IPT? ▼

Yes. You can view or download the TSV358IPT.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for TSV358IPT, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for TSV358IPT? ▼

Yes. Based on your application, preferred manufacturer, package 8-TSSOP (0.173, 4.40mm Width), electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for TSV358IPT. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use TSV358IPT? ▼

As a Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps product from STMicroelectronics, TSV358IPT may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.