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TSV612AIST STMicroelectronics

Part No.:: TSV612AIST

Manufacturer:: STMicroelectronics

Category:: Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps

Package:: 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)

Datasheet:: TSV612AIST.pdf

Description:: IC CMOS 2 CIRCUIT 8MINISO

Quantity:: RFQ Add to RFQ List Buy Now Add to Cart

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Application Scenarios

What Applications Is TSV612AIST Suitable For?

TSV612AIST is a Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps product from STMicroelectronics, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps components. Engineers can review the TSV612AIST datasheet, package 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original STMicroelectronics components are required, helping engineers evaluate TSV612AIST specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the TSV612AIST description, package 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports TSV612AIST datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for TSV612AIST Pricing & Technical Support

Product Overview

TSV612AIST is a Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps product from STMicroelectronics. It is supplied in package 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide TSV612AIST datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: IC CMOS 2 CIRCUIT 8MINISO

Key Features

Part Number:TSV612AIST
Manufacturer:STMicroelectronics
Category:Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps
Package:8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

TSV612AIST may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for TSV612AIST stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Package/Case:

8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
Packaging:

Tape & Reel (TR),Cut Tape (CT)
Series:

-
ProductStatus:

Active
AmplifierType:

CMOS
NumberofCircuits:

2
OutputType:

Rail-to-Rail
SlewRate:

0.04V/µs
GainBandwidthProduct:

120 kHz
-3dbBandwidth:

-
Current-InputBias:

1 pA
Voltage-InputOffset:

800 µV
Current-Supply:

10.5µA
Current-Output/Channel:

63 mA
Voltage-SupplySpan(Min):

1.5 V
Voltage-SupplySpan(Max):

5.5 V
OperatingTemperature:

-40°C ~ 85°C
MountingType:

Surface Mount
Category:

Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps
Datasheet:

TSV612AIST.pdf

TSV612AIST Frequently Asked Questions

Is TSV612AIST currently in stock? ▼

FudongIC currently shows 3,950 units of TSV612AIST in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for TSV612AIST? ▼

The minimum order quantity currently shown for TSV612AIST is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is TSV612AIST original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for TSV612AIST, please note this in your RFQ.

Can you provide a datasheet or technical support for TSV612AIST? ▼

Yes. You can view or download the TSV612AIST.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for TSV612AIST, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for TSV612AIST? ▼

Yes. Based on your application, preferred manufacturer, package 8-TSSOP, 8-MSOP (0.118, 3.00mm Width), electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for TSV612AIST. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use TSV612AIST? ▼

As a Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps product from STMicroelectronics, TSV612AIST may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.