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TSXPC860SRVZQU66D Microchip Technology

Part No.:: TSXPC860SRVZQU66D

Manufacturer:: Microchip Technology

Category:: Embedded - Microprocessors

Package:: 357-BBGA

Datasheet:: TSXPC860SRVZQU66D.pdf

Description:: IC MPU POWERPC 66MHZ 357BGA

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Application Scenarios

What Applications Is TSXPC860SRVZQU66D Suitable For?

TSXPC860SRVZQU66D is a Embedded - Microprocessors product from Microchip Technology, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Embedded - Microprocessors components. Engineers can review the TSXPC860SRVZQU66D datasheet, package 357-BBGA and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original Microchip Technology components are required, helping engineers evaluate TSXPC860SRVZQU66D specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the TSXPC860SRVZQU66D description, package 357-BBGA and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports TSXPC860SRVZQU66D datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for TSXPC860SRVZQU66D Pricing & Technical Support

Product Overview

TSXPC860SRVZQU66D is a Embedded - Microprocessors product from Microchip Technology. It is supplied in package 357-BBGA and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide TSXPC860SRVZQU66D datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: IC MPU POWERPC 66MHZ 357BGA

Key Features

Part Number:TSXPC860SRVZQU66D
Manufacturer:Microchip Technology
Category:Embedded - Microprocessors
Package:357-BBGA
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

TSXPC860SRVZQU66D may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for TSXPC860SRVZQU66D stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Package/Case:

357-BBGA
Packaging:

Tray
Series:

-
ProductStatus:

Obsolete
CoreProcessor:

PowerPC
NumberofCores/BusWidth:

1 Core, 32-Bit
Speed:

66MHz
Co-Processors/DSP:

Communications; CPM
RAMControllers:

DRAM
GraphicsAcceleration:

No
Display&InterfaceControllers:

-
Ethernet:

10/100Mbps (1)
SATA:

-
USB:

-
Voltage-I/O:

3.3V
OperatingTemperature:

-40°C ~ 110°C (TC)
SecurityFeatures:

-
Category:

Embedded - Microprocessors
Datasheet:

TSXPC860SRVZQU66D.pdf

TSXPC860SRVZQU66D Frequently Asked Questions

Is TSXPC860SRVZQU66D currently in stock? ▼

FudongIC currently shows 2,775 units of TSXPC860SRVZQU66D in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for TSXPC860SRVZQU66D? ▼

The minimum order quantity currently shown for TSXPC860SRVZQU66D is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is TSXPC860SRVZQU66D original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for TSXPC860SRVZQU66D, please note this in your RFQ.

Can you provide a datasheet or technical support for TSXPC860SRVZQU66D? ▼

Yes. You can view or download the TSXPC860SRVZQU66D.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for TSXPC860SRVZQU66D, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for TSXPC860SRVZQU66D? ▼

Yes. Based on your application, preferred manufacturer, package 357-BBGA, electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for TSXPC860SRVZQU66D. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use TSXPC860SRVZQU66D? ▼

As a Embedded - Microprocessors product from Microchip Technology, TSXPC860SRVZQU66D may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.