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TXBF032025B CTS Thermal Management Products

Part No.:: TXBF032025B

Manufacturer:: CTS Thermal Management Products

Category:: Thermal - Heat Sinks

Package:: TO-5

Datasheet:: TXBF032025B.pdf

Description:: THERMAL LINK PRESSON TO-5

Quantity:: RFQ Add to RFQ List Buy Now Add to Cart

Unit Price:Request Quote

Total:Submit an RFQ for pricing

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Application Scenarios

What Applications Is TXBF032025B Suitable For?

TXBF032025B is a Thermal - Heat Sinks product from CTS Thermal Management Products, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Thermal - Heat Sinks components. Engineers can review the TXBF032025B datasheet, package TO-5 and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original CTS Thermal Management Products components are required, helping engineers evaluate TXBF032025B specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the TXBF032025B description, package TO-5 and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports TXBF032025B datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for TXBF032025B Pricing & Technical Support

Product Overview

TXBF032025B is a Thermal - Heat Sinks product from CTS Thermal Management Products. It is supplied in package TO-5 and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide TXBF032025B datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: THERMAL LINK PRESSON TO-5

Key Features

Part Number:TXBF032025B
Manufacturer:CTS Thermal Management Products
Category:Thermal - Heat Sinks
Package:TO-5
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

TXBF032025B may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for TXBF032025B stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Packaging:

-
Series:

Fan Top
ProductStatus:

Obsolete
Type:

Top Mount
PackageCooled:

Press Fit
AttachmentMethod:

Cylindrical
Shape:

-
Length:

-
Width:

0.750 (19.05mm) OD
Diameter:

0.250 (6.35mm)
FinHeight:

-
PowerDissipation@TemperatureRise:

-
ThermalResistance@ForcedAirFlow:

81.10°C/W
ThermalResistance@Natural:

Beryllium Copper
Material:
Category:

Thermal - Heat Sinks
Datasheet:

TXBF032025B.pdf

TXBF032025B Frequently Asked Questions

Is TXBF032025B currently in stock? ▼

FudongIC currently shows 3,811 units of TXBF032025B in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for TXBF032025B? ▼

The minimum order quantity currently shown for TXBF032025B is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is TXBF032025B original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for TXBF032025B, please note this in your RFQ.

Can you provide a datasheet or technical support for TXBF032025B? ▼

Yes. You can view or download the TXBF032025B.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for TXBF032025B, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for TXBF032025B? ▼

Yes. Based on your application, preferred manufacturer, package TO-5, electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for TXBF032025B. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use TXBF032025B? ▼

As a Thermal - Heat Sinks product from CTS Thermal Management Products, TXBF032025B may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.