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TXBF2-050-033B CTS Thermal Management Products

Part No.:: TXBF2-050-033B

Manufacturer:: CTS Thermal Management Products

Category:: Thermal - Heat Sinks

Package:: TO-8

Datasheet:: TXBF2-050-033B.pdf

Description:: SINGLE FAN TO BLACK TO8

Quantity:: RFQ Add to RFQ List Buy Now Add to Cart

Unit Price:Request Quote

Total:Submit an RFQ for pricing

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Application Scenarios

What Applications Is TXBF2-050-033B Suitable For?

TXBF2-050-033B is a Thermal - Heat Sinks product from CTS Thermal Management Products, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Thermal - Heat Sinks components. Engineers can review the TXBF2-050-033B datasheet, package TO-8 and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original CTS Thermal Management Products components are required, helping engineers evaluate TXBF2-050-033B specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the TXBF2-050-033B description, package TO-8 and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports TXBF2-050-033B datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for TXBF2-050-033B Pricing & Technical Support

Product Overview

TXBF2-050-033B is a Thermal - Heat Sinks product from CTS Thermal Management Products. It is supplied in package TO-8 and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide TXBF2-050-033B datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: SINGLE FAN TO BLACK TO8

Key Features

Part Number:TXBF2-050-033B
Manufacturer:CTS Thermal Management Products
Category:Thermal - Heat Sinks
Package:TO-8
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

TXBF2-050-033B may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for TXBF2-050-033B stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Packaging:

-
Series:

Fan Top
ProductStatus:

Obsolete
Type:

Top Mount
PackageCooled:

Press Fit
AttachmentMethod:

Cylindrical
Shape:

-
Length:

-
Width:

1.250 (31.75mm) OD
Diameter:

0.330 (8.38mm)
FinHeight:

-
PowerDissipation@TemperatureRise:

-
ThermalResistance@ForcedAirFlow:

41.00°C/W
ThermalResistance@Natural:

Brass
Material:
Category:

Thermal - Heat Sinks
Datasheet:

TXBF2-050-033B.pdf

TXBF2-050-033B Frequently Asked Questions

Is TXBF2-050-033B currently in stock? ▼

FudongIC currently shows 2,120 units of TXBF2-050-033B in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for TXBF2-050-033B? ▼

The minimum order quantity currently shown for TXBF2-050-033B is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is TXBF2-050-033B original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for TXBF2-050-033B, please note this in your RFQ.

Can you provide a datasheet or technical support for TXBF2-050-033B? ▼

Yes. You can view or download the TXBF2-050-033B.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for TXBF2-050-033B, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for TXBF2-050-033B? ▼

Yes. Based on your application, preferred manufacturer, package TO-8, electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for TXBF2-050-033B. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use TXBF2-050-033B? ▼

As a Thermal - Heat Sinks product from CTS Thermal Management Products, TXBF2-050-033B may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.