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W66CL2NQUAGJ Winbond Electronics

Part No.:: W66CL2NQUAGJ

Manufacturer:: Winbond Electronics

Category:: Memory

Package:: 200-WFBGA

Datasheet:: W66CL2NQUAGJ.pdf

Description:: 4GB LPDDR4, DDP, X32, 1866MHZ, -

Quantity:: RFQ Add to RFQ List Buy Now Add to Cart

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Application Scenarios

What Applications Is W66CL2NQUAGJ Suitable For?

W66CL2NQUAGJ is a Memory product from Winbond Electronics, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Memory components. Engineers can review the W66CL2NQUAGJ datasheet, package 200-WFBGA and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original Winbond Electronics components are required, helping engineers evaluate W66CL2NQUAGJ specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the W66CL2NQUAGJ description, package 200-WFBGA and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports W66CL2NQUAGJ datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for W66CL2NQUAGJ Pricing & Technical Support

Product Overview

W66CL2NQUAGJ is a Memory product from Winbond Electronics. It is supplied in package 200-WFBGA and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide W66CL2NQUAGJ datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: 4GB LPDDR4, DDP, X32, 1866MHZ, -

Key Features

Part Number:W66CL2NQUAGJ
Manufacturer:Winbond Electronics
Category:Memory
Package:200-WFBGA
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

W66CL2NQUAGJ may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for W66CL2NQUAGJ stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Packaging:

Tray
Series:

-
ProductStatus:

Not For New Designs
MemoryType:

Volatile
MemoryFormat:

DRAM
Technology:

SDRAM - Mobile LPDDR4
MemorySize:

4Gb (128M x 32)
MemoryInterface:

LVSTL_11
ClockFrequency:

1.866 GHz
WriteCycleTime-WordPage:

18ns
AccessTime:

3.5 ns
Voltage-Supply:

1.06V ~ 1.17V, 1.7V ~ 1.95V
OperatingTemperature:

-40°C ~ 105°C (TC)
MountingType:

Surface Mount
Category:

Memory
Datasheet:

W66CL2NQUAGJ.pdf

W66CL2NQUAGJ Frequently Asked Questions

Is W66CL2NQUAGJ currently in stock? ▼

FudongIC currently shows 2,525 units of W66CL2NQUAGJ in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for W66CL2NQUAGJ? ▼

The minimum order quantity currently shown for W66CL2NQUAGJ is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is W66CL2NQUAGJ original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for W66CL2NQUAGJ, please note this in your RFQ.

Can you provide a datasheet or technical support for W66CL2NQUAGJ? ▼

Yes. You can view or download the W66CL2NQUAGJ.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for W66CL2NQUAGJ, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for W66CL2NQUAGJ? ▼

Yes. Based on your application, preferred manufacturer, package 200-WFBGA, electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for W66CL2NQUAGJ. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use W66CL2NQUAGJ? ▼

As a Memory product from Winbond Electronics, W66CL2NQUAGJ may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.