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W66CM2NQUAFJ Winbond Electronics

Part No.:: W66CM2NQUAFJ

Manufacturer:: Winbond Electronics

Category:: Memory

Package:: Surface Mount

Datasheet:: W66CM2NQUAFJ.pdf

Description:: 4GB LPDDR4X, DDP, X32, 1600MHZ

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Application Scenarios

What Applications Is W66CM2NQUAFJ Suitable For?

W66CM2NQUAFJ is a Memory product from Winbond Electronics, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Memory components. Engineers can review the W66CM2NQUAFJ datasheet, package Surface Mount and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original Winbond Electronics components are required, helping engineers evaluate W66CM2NQUAFJ specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the W66CM2NQUAFJ description, package Surface Mount and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports W66CM2NQUAFJ datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for W66CM2NQUAFJ Pricing & Technical Support

Product Overview

W66CM2NQUAFJ is a Memory product from Winbond Electronics. It is supplied in package Surface Mount and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide W66CM2NQUAFJ datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: 4GB LPDDR4X, DDP, X32, 1600MHZ

Key Features

Part Number:W66CM2NQUAFJ
Manufacturer:Winbond Electronics
Category:Memory
Package:Surface Mount
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

W66CM2NQUAFJ may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for W66CM2NQUAFJ stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Packaging:

Tray
Series:

-
ProductStatus:

Not For New Designs
MemoryType:

Volatile
MemoryFormat:

DRAM
Technology:

SDRAM - Mobile LPDDR4X
MemorySize:

4Gb (128M x 32)
MemoryInterface:

LVSTL_11
ClockFrequency:

1.6 GHz
WriteCycleTime-WordPage:

18ns
AccessTime:

3.5 ns
Voltage-Supply:

1.06V ~ 1.17V, 1.7V ~ 1.95V
OperatingTemperature:

-40°C ~ 105°C (TC)
MountingType:

Surface Mount
Category:

Memory
Datasheet:

W66CM2NQUAFJ.pdf

W66CM2NQUAFJ Frequently Asked Questions

Is W66CM2NQUAFJ currently in stock? ▼

FudongIC currently shows 3,475 units of W66CM2NQUAFJ in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for W66CM2NQUAFJ? ▼

The minimum order quantity currently shown for W66CM2NQUAFJ is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is W66CM2NQUAFJ original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for W66CM2NQUAFJ, please note this in your RFQ.

Can you provide a datasheet or technical support for W66CM2NQUAFJ? ▼

Yes. You can view or download the W66CM2NQUAFJ.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for W66CM2NQUAFJ, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for W66CM2NQUAFJ? ▼

Yes. Based on your application, preferred manufacturer, package Surface Mount, electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for W66CM2NQUAFJ. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use W66CM2NQUAFJ? ▼

As a Memory product from Winbond Electronics, W66CM2NQUAFJ may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.