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XAZU11EG-1FFVF1517I AMD Xilinx

Part No.:: XAZU11EG-1FFVF1517I

Manufacturer:: AMD Xilinx

Category:: Embedded - System On Chip (SoC)

Package:: 1517-BBGA, FCBGA

Datasheet:: XAZU11EG-1FFVF1517I.pdf

Description:: IC ZUS MPSOC FPGA 1517FCBGA

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Application Scenarios

What Applications Is XAZU11EG-1FFVF1517I Suitable For?

XAZU11EG-1FFVF1517I is a Embedded - System On Chip (SoC) product from AMD Xilinx, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Embedded - System On Chip (SoC) components. Engineers can review the XAZU11EG-1FFVF1517I datasheet, package 1517-BBGA, FCBGA and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original AMD Xilinx components are required, helping engineers evaluate XAZU11EG-1FFVF1517I specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the XAZU11EG-1FFVF1517I description, package 1517-BBGA, FCBGA and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports XAZU11EG-1FFVF1517I datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for XAZU11EG-1FFVF1517I Pricing & Technical Support

Product Overview

XAZU11EG-1FFVF1517I is a Embedded - System On Chip (SoC) product from AMD Xilinx. It is supplied in package 1517-BBGA, FCBGA and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide XAZU11EG-1FFVF1517I datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: IC ZUS MPSOC FPGA 1517FCBGA

Key Features

Part Number:XAZU11EG-1FFVF1517I
Manufacturer:AMD Xilinx
Category:Embedded - System On Chip (SoC)
Package:1517-BBGA, FCBGA
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

XAZU11EG-1FFVF1517I may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for XAZU11EG-1FFVF1517I stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Package/Case:

1517-BBGA, FCBGA
Packaging:

Tray
Series:

Zynq® UltraScale+™ MPSoC EG
ProductStatus:

Active
Architecture:

MPU, FPGA
CoreProcessor:

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
FlashSize:

-
RAMSize:

256KB
Peripherals:

DMA, WDT
Connectivity:

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:

500MHz, 600MHz, 1.2GHz
PrimaryAttributes:

Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
OperatingTemperature:

-40°C ~ 100°C (TJ)
Category:

Embedded - System On Chip (SoC)
Datasheet:

XAZU11EG-1FFVF1517I.pdf

XAZU11EG-1FFVF1517I Frequently Asked Questions

Is XAZU11EG-1FFVF1517I currently in stock? ▼

FudongIC currently shows 3,434 units of XAZU11EG-1FFVF1517I in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for XAZU11EG-1FFVF1517I? ▼

The minimum order quantity currently shown for XAZU11EG-1FFVF1517I is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is XAZU11EG-1FFVF1517I original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for XAZU11EG-1FFVF1517I, please note this in your RFQ.

Can you provide a datasheet or technical support for XAZU11EG-1FFVF1517I? ▼

Yes. You can view or download the XAZU11EG-1FFVF1517I.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for XAZU11EG-1FFVF1517I, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for XAZU11EG-1FFVF1517I? ▼

Yes. Based on your application, preferred manufacturer, package 1517-BBGA, FCBGA, electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for XAZU11EG-1FFVF1517I. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use XAZU11EG-1FFVF1517I? ▼

As a Embedded - System On Chip (SoC) product from AMD Xilinx, XAZU11EG-1FFVF1517I may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.