XC705B32CBE NXP USA Inc.

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Part No.:: XC705B32CBE

Manufacturer:: NXP USA Inc.

Category:: Embedded - Microcontrollers

Package:: 56-SDIP (0.600", 15.24mm)

Datasheet:: XC705B32CBE.pdf

Description:: IC MCU 8BIT 32KB OTP 56PSDIP

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Application Scenarios

What Applications Is XC705B32CBE Suitable For?

XC705B32CBE is a Embedded - Microcontrollers product from NXP USA Inc., suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Embedded - Microcontrollers components. Engineers can review the XC705B32CBE datasheet, package 56-SDIP (0.600", 15.24mm) and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original NXP USA Inc. components are required, helping engineers evaluate XC705B32CBE specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the XC705B32CBE description, package 56-SDIP (0.600", 15.24mm) and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports XC705B32CBE datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for XC705B32CBE Pricing & Technical Support

Product Overview

XC705B32CBE is a Embedded - Microcontrollers product from NXP USA Inc.. It is supplied in package 56-SDIP (0.600", 15.24mm) and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide XC705B32CBE datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: IC MCU 8BIT 32KB OTP 56PSDIP

Key Features

Part Number:XC705B32CBE
Manufacturer:NXP USA Inc.
Category:Embedded - Microcontrollers
Package:56-SDIP (0.600", 15.24mm)
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

XC705B32CBE may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for XC705B32CBE stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Package/Case:

56-SDIP (0.600", 15.24mm)
Packaging:

Tube
Series:

HC05
ProductStatus:

RoHS
CoreProcessor:

2.1MHz
CoreSize:

528 x 8
Speed:

8-Bit
Connectivity:

256 x 8
Peripherals:

Obsolete
NumberofI/O:

POR, WDT
ProgramMemorySize:

SCI
ProgramMemoryType:

Through Hole
EEPROMSize:

32
RAMSize:

HC05
Voltage-Supply(Vcc/Vdd):

A/D 8x8b; D/A 2x8b
DataConverters:

Internal
OscillatorType:

32KB (32K x 8)
OperatingTemperature:

OTP
MountingType:

-40°C ~ 85°C (TA)
Category:

Embedded - Microcontrollers
Datasheet:

XC705B32CBE.pdf

XC705B32CBE Frequently Asked Questions

Is XC705B32CBE currently in stock? ▼

FudongIC currently shows 3,244 units of XC705B32CBE in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for XC705B32CBE? ▼

The minimum order quantity currently shown for XC705B32CBE is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is XC705B32CBE original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for XC705B32CBE, please note this in your RFQ.

Can you provide a datasheet or technical support for XC705B32CBE? ▼

Yes. You can view or download the XC705B32CBE.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for XC705B32CBE, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for XC705B32CBE? ▼

Yes. Based on your application, preferred manufacturer, package 56-SDIP (0.600", 15.24mm), electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for XC705B32CBE. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use XC705B32CBE? ▼

As a Embedded - Microcontrollers product from NXP USA Inc., XC705B32CBE may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.