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XCZU17EG-3FFVE1924E AMD Xilinx

Part No.:: XCZU17EG-3FFVE1924E

Manufacturer:: AMD Xilinx

Category:: Embedded - System On Chip (SoC)

Package:: 1924-BBGA, FCBGA

Datasheet:: XCZU17EG-3FFVE1924E.pdf

Description:: IC SOC CORTEX-A53 1924FCBGA

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Application Scenarios

What Applications Is XCZU17EG-3FFVE1924E Suitable For?

XCZU17EG-3FFVE1924E is a Embedded - System On Chip (SoC) product from AMD Xilinx, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Embedded - System On Chip (SoC) components. Engineers can review the XCZU17EG-3FFVE1924E datasheet, package 1924-BBGA, FCBGA and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original AMD Xilinx components are required, helping engineers evaluate XCZU17EG-3FFVE1924E specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the XCZU17EG-3FFVE1924E description, package 1924-BBGA, FCBGA and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports XCZU17EG-3FFVE1924E datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for XCZU17EG-3FFVE1924E Pricing & Technical Support

Product Overview

XCZU17EG-3FFVE1924E is a Embedded - System On Chip (SoC) product from AMD Xilinx. It is supplied in package 1924-BBGA, FCBGA and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide XCZU17EG-3FFVE1924E datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: IC SOC CORTEX-A53 1924FCBGA

Key Features

Part Number:XCZU17EG-3FFVE1924E
Manufacturer:AMD Xilinx
Category:Embedded - System On Chip (SoC)
Package:1924-BBGA, FCBGA
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

XCZU17EG-3FFVE1924E may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for XCZU17EG-3FFVE1924E stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Package/Case:

1924-BBGA, FCBGA
Packaging:

Tray
Series:

Zynq® UltraScale+™ MPSoC EG
ProductStatus:

Active
Architecture:

MCU, FPGA
CoreProcessor:

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
FlashSize:

-
RAMSize:

256KB
Peripherals:

DMA, WDT
Connectivity:

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:

600MHz, 667MHz, 1.5GHz
PrimaryAttributes:

Zynq®UltraScale+™ FPGA, 926K+ Logic Cells
OperatingTemperature:

0°C ~ 100°C (TJ)
Category:

Embedded - System On Chip (SoC)
Datasheet:

XCZU17EG-3FFVE1924E.pdf

XCZU17EG-3FFVE1924E Frequently Asked Questions

Is XCZU17EG-3FFVE1924E currently in stock? ▼

FudongIC currently shows 3,114 units of XCZU17EG-3FFVE1924E in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for XCZU17EG-3FFVE1924E? ▼

The minimum order quantity currently shown for XCZU17EG-3FFVE1924E is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is XCZU17EG-3FFVE1924E original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for XCZU17EG-3FFVE1924E, please note this in your RFQ.

Can you provide a datasheet or technical support for XCZU17EG-3FFVE1924E? ▼

Yes. You can view or download the XCZU17EG-3FFVE1924E.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for XCZU17EG-3FFVE1924E, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for XCZU17EG-3FFVE1924E? ▼

Yes. Based on your application, preferred manufacturer, package 1924-BBGA, FCBGA, electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for XCZU17EG-3FFVE1924E. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use XCZU17EG-3FFVE1924E? ▼

As a Embedded - System On Chip (SoC) product from AMD Xilinx, XCZU17EG-3FFVE1924E may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.