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XLI98-10-10-2.25 t-Global Technology

Part No.:: XLI98-10-10-2.25

Manufacturer:: t-Global Technology

Category:: Thermal - Heat Sinks

Package:: Assorted (BGA, LGA, CPU, ASIC...)

Datasheet:: XLI98-10-10-2.25.pdf

Description:: XL25 CERAMIC 10X10MM W/LI98C ADH

Quantity:: RFQ Add to RFQ List Buy Now Add to Cart

Unit Price:Request Quote

Total:Submit an RFQ for pricing

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Application Scenarios

What Applications Is XLI98-10-10-2.25 Suitable For?

XLI98-10-10-2.25 is a Thermal - Heat Sinks product from t-Global Technology, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Thermal - Heat Sinks components. Engineers can review the XLI98-10-10-2.25 datasheet, package Assorted (BGA, LGA, CPU, ASIC...) and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original t-Global Technology components are required, helping engineers evaluate XLI98-10-10-2.25 specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the XLI98-10-10-2.25 description, package Assorted (BGA, LGA, CPU, ASIC...) and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports XLI98-10-10-2.25 datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for XLI98-10-10-2.25 Pricing & Technical Support

Product Overview

XLI98-10-10-2.25 is a Thermal - Heat Sinks product from t-Global Technology. It is supplied in package Assorted (BGA, LGA, CPU, ASIC...) and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide XLI98-10-10-2.25 datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: XL25 CERAMIC 10X10MM W/LI98C ADH

Key Features

Part Number:XLI98-10-10-2.25
Manufacturer:t-Global Technology
Category:Thermal - Heat Sinks
Package:Assorted (BGA, LGA, CPU, ASIC...)
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

XLI98-10-10-2.25 may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for XLI98-10-10-2.25 stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Packaging:

Box
Series:

XL-25
ProductStatus:

Obsolete
Type:

Heat Spreader
PackageCooled:

Thermal Tape, Adhesive (Included)
AttachmentMethod:

Square
Shape:

0.394 (10.00mm)
Length:

0.394 (10.00mm)
Width:

-
Diameter:

0.089 (2.25mm)
FinHeight:

-
PowerDissipation@TemperatureRise:

-
ThermalResistance@ForcedAirFlow:

-
ThermalResistance@Natural:

Ceramic
Material:
Category:

Thermal - Heat Sinks
Datasheet:

XLI98-10-10-2.25.pdf

XLI98-10-10-2.25 Frequently Asked Questions

Is XLI98-10-10-2.25 currently in stock? ▼

FudongIC currently shows 3,849 units of XLI98-10-10-2.25 in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for XLI98-10-10-2.25? ▼

The minimum order quantity currently shown for XLI98-10-10-2.25 is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is XLI98-10-10-2.25 original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for XLI98-10-10-2.25, please note this in your RFQ.

Can you provide a datasheet or technical support for XLI98-10-10-2.25? ▼

Yes. You can view or download the XLI98-10-10-2.25.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for XLI98-10-10-2.25, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for XLI98-10-10-2.25? ▼

Yes. Based on your application, preferred manufacturer, package Assorted (BGA, LGA, CPU, ASIC...), electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for XLI98-10-10-2.25. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use XLI98-10-10-2.25? ▼

As a Thermal - Heat Sinks product from t-Global Technology, XLI98-10-10-2.25 may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.