Hello! now About Us
+86 075582561136
sales19@fudongic.com
Upload BOM
Oscillators
| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Package/Case | Packaging | Series | ProductStatus | BaseResonator | Type | Frequency | Function | Output | Voltage-Supply | FrequencyStability | AbsolutePullRange(APR) | OperatingTemperature | SpreadSpectrumBandwidth | Current-Supply(Max) | Ratings | MountingType | Size/Dimension |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
DSC6111JI1B-024.0000TMEMS OSC LVCMOS 50PPM 2.5X2.0MM Microchip Technology |
2,106 | - |
RFQ |
Datasheet |
4-VLGA | Tape & Reel (TR) | DSC61XXB | Active | MEMS | XO (Standard) | 24 MHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | ±50ppm | - | -40°C ~ 85°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.098 L x 0.079 W (2.50mm x 2.00mm) |
|
|
DSC6111JI2B-032K768MEMS OSC LVCMOS 25PPM 2.5X2.0MM Microchip Technology |
2,219 | - |
RFQ |
Datasheet |
4-VLGA | Tube | DSC61XXB | Active | MEMS | XO (Standard) | 32.768 kHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | ±25ppm | - | -40°C ~ 85°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.098 L x 0.079 W (2.50mm x 2.00mm) |
|
|
DSC6111JI2B-032K768TMEMS OSC LVCMOS 25PPM 2.5X2.0MM Microchip Technology |
2,776 | - |
RFQ |
Datasheet |
4-VLGA | Tape & Reel (TR) | DSC61XXB | Active | MEMS | XO (Standard) | 32.768 kHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | ±25ppm | - | -40°C ~ 85°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.098 L x 0.079 W (2.50mm x 2.00mm) |
|
|
DSC6111JI2B-250K000MEMS OSC LVCMOS 25PPM 2.5X2.0MM Microchip Technology |
3,224 | - |
RFQ |
Datasheet |
4-VLGA | Tube | DSC61XXB | Active | MEMS | XO (Standard) | 250 kHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | ±25ppm | - | -40°C ~ 85°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.098 L x 0.079 W (2.50mm x 2.00mm) |
|
|
DSC6111JI2B-250K000TMEMS OSC LVCMOS 25PPM 2.5X2.0MM Microchip Technology |
3,790 | - |
RFQ |
Datasheet |
4-VLGA | Tape & Reel (TR) | DSC61XXB | Active | MEMS | XO (Standard) | 250 kHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | ±25ppm | - | -40°C ~ 85°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.098 L x 0.079 W (2.50mm x 2.00mm) |
|
|
DSC6111JI2B-432K000MEMS OSC LVCMOS 25PPM 2.5X2.0MM Microchip Technology |
3,279 | - |
RFQ |
Datasheet |
4-VLGA | Tube | DSC61XXB | Active | MEMS | XO (Standard) | 432 kHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | ±25ppm | - | -40°C ~ 85°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.098 L x 0.079 W (2.50mm x 2.00mm) |
|
|
DSC6111JI2B-432K000TMEMS OSC LVCMOS 25PPM 2.5X2.0MM Microchip Technology |
3,025 | - |
RFQ |
Datasheet |
4-VLGA | Tape & Reel (TR) | DSC61XXB | Active | MEMS | XO (Standard) | 432 kHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | ±25ppm | - | -40°C ~ 85°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.098 L x 0.079 W (2.50mm x 2.00mm) |
|
|
DSC6111JI2B-720K000MEMS OSC LVCMOS 25PPM 2.5X2.0MM Microchip Technology |
3,287 | - |
RFQ |
Datasheet |
4-VLGA | Tube | DSC61XXB | Active | MEMS | XO (Standard) | 720 kHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | ±25ppm | - | -40°C ~ 85°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.098 L x 0.079 W (2.50mm x 2.00mm) |
|
|
DSC6111JI2B-720K000TMEMS OSC LVCMOS 25PPM 2.5X2.0MM Microchip Technology |
3,362 | - |
RFQ |
Datasheet |
4-VLGA | Tape & Reel (TR) | DSC61XXB | Active | MEMS | XO (Standard) | 720 kHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | ±25ppm | - | -40°C ~ 85°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.098 L x 0.079 W (2.50mm x 2.00mm) |
|
|
DSC6111MI2B-024.5454MEMS OSC LVCMOS 25PPM 2X1.6MM Microchip Technology |
2,948 | - |
RFQ |
Datasheet |
4-VFLGA | Bag | DSC61XXB | Active | MEMS | XO (Standard) | 24.5454 MHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | ±25ppm | - | -40°C ~ 85°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.079 L x 0.063 W (2.00mm x 1.60mm) |
|
|
DSC6111MI2B-024.5454TMEMS OSC LVCMOS 25PPM 2X1.6MM Microchip Technology |
2,652 | - |
RFQ |
Datasheet |
4-VFLGA | Tape & Reel (TR) | DSC61XXB | Active | MEMS | XO (Standard) | 24.5454 MHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | ±25ppm | - | -40°C ~ 85°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.079 L x 0.063 W (2.00mm x 1.60mm) |
|
|
DSC6111MI2B-027.0000MEMS OSC LVCMOS 25PPM 2X1.6MM Microchip Technology |
2,418 | - |
RFQ |
Datasheet |
4-VFLGA | Bag | DSC61XXB | Active | MEMS | XO (Standard) | 27 MHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | ±25ppm | - | -40°C ~ 85°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.079 L x 0.063 W (2.00mm x 1.60mm) |
|
|
DSC6111MI2B-027.0000TMEMS OSC LVCMOS 25PPM 2X1.6MM Microchip Technology |
2,132 | - |
RFQ |
Datasheet |
4-VFLGA | Tape & Reel (TR) | DSC61XXB | Active | MEMS | XO (Standard) | 27 MHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | ±25ppm | - | -40°C ~ 85°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.079 L x 0.063 W (2.00mm x 1.60mm) |
|
|
DSC6112HI2B-001.0000MEMS OSC LVCMOS 25PPM 1.6X1.2MM Microchip Technology |
3,409 | - |
RFQ |
Datasheet |
4-VFLGA | Bag | DSC61XXB | Active | MEMS | XO (Standard) | 1 MHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | ±25ppm | - | -40°C ~ 85°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.063 L x 0.047 W (1.60mm x 1.20mm) |
|
|
DSC6112HI2B-001.0000TMEMS OSC LVCMOS 25PPM 1.6X1.2MM Microchip Technology |
2,648 | - |
RFQ |
Datasheet |
4-VFLGA | Tape & Reel (TR) | DSC61XXB | Active | MEMS | XO (Standard) | 1 MHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | ±25ppm | - | -40°C ~ 85°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.063 L x 0.047 W (1.60mm x 1.20mm) |
|
|
DSC6112HI2B-032K768MEMS OSC LVCMOS 25PPM 1.6X1.2MM Microchip Technology |
3,012 | - |
RFQ |
Datasheet |
4-VFLGA | Bag | DSC61XXB | Active | MEMS | XO (Standard) | 32.768 kHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | ±25ppm | - | -40°C ~ 85°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.063 L x 0.047 W (1.60mm x 1.20mm) |
|
|
DSC6112HI2B-032K768TMEMS OSC LVCMOS 25PPM 1.6X1.2MM Microchip Technology |
3,117 | - |
RFQ |
Datasheet |
4-VFLGA | Tape & Reel (TR) | DSC61XXB | Active | MEMS | XO (Standard) | 32.768 kHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | ±25ppm | - | -40°C ~ 85°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.063 L x 0.047 W (1.60mm x 1.20mm) |
|
|
DSC6112HI2B-250K000MEMS OSC LVCMOS 25PPM 1.6X1.2MM Microchip Technology |
2,549 | - |
RFQ |
Datasheet |
4-VFLGA | Bag | DSC61XXB | Active | MEMS | XO (Standard) | 250 kHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | ±25ppm | - | -40°C ~ 85°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.063 L x 0.047 W (1.60mm x 1.20mm) |
|
|
DSC6112HI2B-250K000TMEMS OSC LVCMOS 25PPM 1.6X1.2MM Microchip Technology |
3,395 | - |
RFQ |
Datasheet |
4-VFLGA | Tape & Reel (TR) | DSC61XXB | Active | MEMS | XO (Standard) | 250 kHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | ±25ppm | - | -40°C ~ 85°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.063 L x 0.047 W (1.60mm x 1.20mm) |
|
|
DSC6112HI2B-432K000MEMS OSC LVCMOS 25PPM 1.6X1.2MM Microchip Technology |
3,326 | - |
RFQ |
Datasheet |
4-VFLGA | Bag | DSC61XXB | Active | MEMS | XO (Standard) | 432 kHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | ±25ppm | - | -40°C ~ 85°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.063 L x 0.047 W (1.60mm x 1.20mm) |
Request a Quote
- 1500+ Daily average RFQ Volume
- 20,000.000 Standard Product Unit
- 1800+ Worldwide Manufacturers
- 15,000+ In-stock Warehouse
