Hello! now About Us
+86 075582561136
sales19@fudongic.com
Upload BOM
Oscillators
| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Package/Case | Packaging | Series | ProductStatus | BaseResonator | Type | Frequency | Function | Output | Voltage-Supply | FrequencyStability | AbsolutePullRange(APR) | OperatingTemperature | SpreadSpectrumBandwidth | Current-Supply(Max) | Ratings | MountingType | Size/Dimension |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
DSC6112HI2B-432K000TMEMS OSC LVCMOS 25PPM 1.6X1.2MM Microchip Technology |
2,444 | - |
RFQ |
Datasheet |
4-VFLGA | Tape & Reel (TR) | DSC61XXB | Active | MEMS | XO (Standard) | 432 kHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | ±25ppm | - | -40°C ~ 85°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.063 L x 0.047 W (1.60mm x 1.20mm) |
|
|
DSC6112HI2B-720K000MEMS OSC LVCMOS 25PPM 1.6X1.2MM Microchip Technology |
2,245 | - |
RFQ |
Datasheet |
4-VFLGA | Bag | DSC61XXB | Active | MEMS | XO (Standard) | 720 kHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | ±25ppm | - | -40°C ~ 85°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.063 L x 0.047 W (1.60mm x 1.20mm) |
|
|
DSC6112HI2B-720K000TMEMS OSC LVCMOS 25PPM 1.6X1.2MM Microchip Technology |
3,890 | - |
RFQ |
Datasheet |
4-VFLGA | Tape & Reel (TR) | DSC61XXB | Active | MEMS | XO (Standard) | 720 kHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | ±25ppm | - | -40°C ~ 85°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.063 L x 0.047 W (1.60mm x 1.20mm) |
|
|
DSC6112JI2B-001.0000MEMS OSC LVCMOS 25PPM 2.5X2.0MM Microchip Technology |
2,718 | - |
RFQ |
Datasheet |
4-VLGA | Tube | DSC61XXB | Active | MEMS | XO (Standard) | 1 MHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | ±25ppm | - | -40°C ~ 85°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.098 L x 0.079 W (2.50mm x 2.00mm) |
|
|
DSC6112JI2B-001.0000TMEMS OSC LVCMOS 25PPM 2.5X2.0MM Microchip Technology |
3,920 | - |
RFQ |
Datasheet |
4-VLGA | Tape & Reel (TR) | DSC61XXB | Active | MEMS | XO (Standard) | 1 MHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | ±25ppm | - | -40°C ~ 85°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.098 L x 0.079 W (2.50mm x 2.00mm) |
|
|
DSC6112JI2B-032K768MEMS OSC LVCMOS 25PPM 2.5X2.0MM Microchip Technology |
3,444 | - |
RFQ |
Datasheet |
4-VLGA | Tube | DSC61XXB | Active | MEMS | XO (Standard) | 32.768 kHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | ±25ppm | - | -40°C ~ 85°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.098 L x 0.079 W (2.50mm x 2.00mm) |
|
|
DSC6112JI2B-032K768TMEMS OSC LVCMOS 25PPM 2.5X2.0MM Microchip Technology |
3,460 | - |
RFQ |
Datasheet |
4-VLGA | Tape & Reel (TR) | DSC61XXB | Active | MEMS | XO (Standard) | 32.768 kHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | ±25ppm | - | -40°C ~ 85°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.098 L x 0.079 W (2.50mm x 2.00mm) |
|
|
DSC6112JI2B-250K000MEMS OSC LVCMOS 25PPM 2.5X2.0MM Microchip Technology |
2,968 | - |
RFQ |
Datasheet |
4-VLGA | Tube | DSC61XXB | Active | MEMS | XO (Standard) | 250 kHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | ±25ppm | - | -40°C ~ 85°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.098 L x 0.079 W (2.50mm x 2.00mm) |
|
|
DSC6112JI2B-250K000TMEMS OSC LVCMOS 25PPM 2.5X2.0MM Microchip Technology |
2,460 | - |
RFQ |
Datasheet |
4-VLGA | Tape & Reel (TR) | DSC61XXB | Active | MEMS | XO (Standard) | 250 kHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | ±25ppm | - | -40°C ~ 85°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.098 L x 0.079 W (2.50mm x 2.00mm) |
|
|
DSC6112JI2B-432K000MEMS OSC LVCMOS 25PPM 2.5X2.0MM Microchip Technology |
3,398 | - |
RFQ |
Datasheet |
4-VLGA | Tube | DSC61XXB | Active | MEMS | XO (Standard) | 432 kHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | ±25ppm | - | -40°C ~ 85°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.098 L x 0.079 W (2.50mm x 2.00mm) |
|
|
DSC6112JI2B-432K000TMEMS OSC LVCMOS 25PPM 2.5X2.0MM Microchip Technology |
3,607 | - |
RFQ |
Datasheet |
4-VLGA | Tape & Reel (TR) | DSC61XXB | Active | MEMS | XO (Standard) | 432 kHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | ±25ppm | - | -40°C ~ 85°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.098 L x 0.079 W (2.50mm x 2.00mm) |
|
|
DSC6112JI2B-720K000MEMS OSC LVCMOS 25PPM 2.5X2.0MM Microchip Technology |
3,841 | - |
RFQ |
Datasheet |
4-VLGA | Tube | DSC61XXB | Active | MEMS | XO (Standard) | 720 kHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | ±25ppm | - | -40°C ~ 85°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.098 L x 0.079 W (2.50mm x 2.00mm) |
|
|
DSC6112JI2B-720K000TMEMS OSC LVCMOS 25PPM 2.5X2.0MM Microchip Technology |
2,384 | - |
RFQ |
Datasheet |
4-VLGA | Tape & Reel (TR) | DSC61XXB | Active | MEMS | XO (Standard) | 720 kHz | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | ±25ppm | - | -40°C ~ 85°C | - | 3mA (Typ) | AEC-Q100 | Surface Mount | 0.098 L x 0.079 W (2.50mm x 2.00mm) |
|
|
DSC6311JI1BA-030.0000SPREAD SPECTRUM MEMS OSC +-0.5% Microchip Technology |
2,399 | - |
RFQ |
Datasheet |
4-VLGA | Tube | DSC63XX | Obsolete | MEMS | XO (Standard) | 30 MHz | Standby (Power Down) | LVCMOS | 1.8V ~ 3.3V | - | - | -40°C ~ 85°C | - | 3mA (Typ) | - | Surface Mount | 0.098 L x 0.079 W (2.50mm x 2.00mm) |
|
|
DSC6311JI1BA-030.0000TSPREAD SPECTRUM MEMS OSC +-0.5% Microchip Technology |
2,843 | - |
RFQ |
Datasheet |
4-VLGA | Tape & Reel (TR) | DSC63XX | Obsolete | MEMS | XO (Standard) | 30 MHz | Standby (Power Down) | LVCMOS | 1.8V ~ 3.3V | - | - | -40°C ~ 85°C | - | 3mA (Typ) | - | Surface Mount | 0.098 L x 0.079 W (2.50mm x 2.00mm) |
|
|
DSC6311JL1BB-028.6364SPREAD SPECTRUM MEMS OSC +-0.5% Microchip Technology |
3,017 | - |
RFQ |
Datasheet |
4-VLGA | Tube | DSC63XXB | Active | MEMS | XO (Standard) | 28.6364 MHz | Standby (Power Down) | LVCMOS | 1.8V ~ 3.3V | ±50ppm | - | -40°C ~ 105°C | - | 3mA (Typ) | - | Surface Mount | 0.098 L x 0.079 W (2.50mm x 2.00mm) |
|
|
DSC6311JL1BB-028.6364TSPREAD SPECTRUM MEMS OSC +-0.5% Microchip Technology |
2,556 | - |
RFQ |
Datasheet |
4-VLGA | Tape & Reel (TR) | DSC63XXB | Active | MEMS | XO (Standard) | 28.6364 MHz | Standby (Power Down) | LVCMOS | 1.8V ~ 3.3V | ±50ppm | - | -40°C ~ 105°C | - | 3mA (Typ) | - | Surface Mount | 0.098 L x 0.079 W (2.50mm x 2.00mm) |
|
|
DSC6331HE1CB-024.0000SPREAD SPECTRUM MEMS OSC +-1.0% Microchip Technology |
3,728 | - |
RFQ |
Datasheet |
4-VFLGA | Bag | DSC63XXB | Active | MEMS | XO (Standard) | 24 MHz | - | LVCMOS | 1.8V ~ 3.3V | ±50ppm | - | -20°C ~ 70°C | ±1.00%, Center Spread | 3mA (Typ) | - | Surface Mount | 0.063 L x 0.047 W (1.60mm x 1.20mm) |
|
|
DSC6331HE1CB-024.0000TSPREAD SPECTRUM MEMS OSC +-1.0% Microchip Technology |
2,973 | - |
RFQ |
Datasheet |
4-VFLGA | Tape & Reel (TR) | DSC63XXB | Active | MEMS | XO (Standard) | 24 MHz | - | LVCMOS | 1.8V ~ 3.3V | ±50ppm | - | -20°C ~ 70°C | ±1.00%, Center Spread | 3mA (Typ) | - | Surface Mount | 0.063 L x 0.047 W (1.60mm x 1.20mm) |
|
|
DSC6331JE1CB-024.0000SPREAD SPECTRUM MEMS OSC +-1.0% Microchip Technology |
3,680 | - |
RFQ |
Datasheet |
4-VLGA | Tube | DSC63XXB | Active | MEMS | XO (Standard) | 24 MHz | - | LVCMOS | 1.8V ~ 3.3V | ±50ppm | - | -20°C ~ 70°C | ±1.00%, Center Spread | 3mA (Typ) | - | Surface Mount | 0.098 L x 0.079 W (2.50mm x 2.00mm) |
Request a Quote
- 1500+ Daily average RFQ Volume
- 20,000.000 Standard Product Unit
- 1800+ Worldwide Manufacturers
- 15,000+ In-stock Warehouse
