Sockets for ICs, Transistors

Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
346-43-107-41-013000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

346-43-107-41-013000

CONN SOCKET SIP 7POS GOLD

Mill-Max Manufacturing Corp.
3,422 -

RFQ

FudongIC

Datasheet

Bulk 346 Active SIP 7 (1 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
ICO-308-STT Samtec Inc. Sockets for ICs, Transistors

ICO-308-STT

CONN IC DIP SOCKET 8POS TIN

Samtec Inc.
3,033 -

RFQ

FudongIC

Datasheet

Tube ICO Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polyester, Glass Filled
116-83-314-41-002101 Preci-Dip Sockets for ICs, Transistors

116-83-314-41-002101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip
3,851 -

RFQ

FudongIC

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-312-41-001101 Preci-Dip Sockets for ICs, Transistors

116-83-312-41-001101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip
2,156 -

RFQ

FudongIC

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-424-41-018101 Preci-Dip Sockets for ICs, Transistors

116-87-424-41-018101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,225 -

RFQ

FudongIC

Datasheet

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-624-41-018101 Preci-Dip Sockets for ICs, Transistors

116-87-624-41-018101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,659 -

RFQ

FudongIC

Datasheet

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-318-41-003101 Preci-Dip Sockets for ICs, Transistors

116-83-318-41-003101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip
2,617 -

RFQ

FudongIC

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-420-41-012101 Preci-Dip Sockets for ICs, Transistors

116-87-420-41-012101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
2,111 -

RFQ

FudongIC

Datasheet

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-320-41-105101 Preci-Dip Sockets for ICs, Transistors

110-83-320-41-105101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
2,703 -

RFQ

FudongIC

Datasheet

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
09-0513-10T Aries Electronics Sockets for ICs, Transistors

09-0513-10T

CONN SOCKET SIP 9POS GOLD

Aries Electronics
3,181 -

RFQ

FudongIC

Datasheet

Bulk 0513 Active SIP 9 (1 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-0518-11 Aries Electronics Sockets for ICs, Transistors

08-0518-11

CONN SOCKET SIP 8POS GOLD

Aries Electronics
3,795 -

RFQ

FudongIC

Datasheet

Bulk 518 Active SIP 8 (1 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-1518-11 Aries Electronics Sockets for ICs, Transistors

08-1518-11

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics
3,433 -

RFQ

FudongIC

Datasheet

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
614-87-324-31-012101 Preci-Dip Sockets for ICs, Transistors

614-87-324-31-012101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,781 -

RFQ

FudongIC

Datasheet

Bulk 614 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-424-31-012101 Preci-Dip Sockets for ICs, Transistors

614-87-424-31-012101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
2,607 -

RFQ

FudongIC

Datasheet

Bulk 614 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
D2922-42 Harwin Inc. Sockets for ICs, Transistors

D2922-42

CONN IC DIP SOCKET 22POS GOLD

Harwin Inc.
3,690 -

RFQ

FudongIC

Datasheet

Tube D2 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Plastic
510-83-032-09-041101 Preci-Dip Sockets for ICs, Transistors

510-83-032-09-041101

CONN SOCKET PGA 32POS GOLD

Preci-Dip
2,629 -

RFQ

FudongIC

Datasheet

Bulk 510 Active PGA 32 (9 x 9) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-320-41-105161 Preci-Dip Sockets for ICs, Transistors

110-83-320-41-105161

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
2,075 -

RFQ

FudongIC

Datasheet

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
124-83-312-41-002101 Preci-Dip Sockets for ICs, Transistors

124-83-312-41-002101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip
2,490 -

RFQ

Bulk 124 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-314-41-009101 Preci-Dip Sockets for ICs, Transistors

116-83-314-41-009101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip
2,225 -

RFQ

FudongIC

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-308-41-013101 Preci-Dip Sockets for ICs, Transistors

116-87-308-41-013101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip
3,654 -

RFQ

FudongIC

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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