Sockets for ICs, Transistors

Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
115-87-636-41-003101 Preci-Dip Sockets for ICs, Transistors

115-87-636-41-003101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip
2,202 -

RFQ

FudongIC

Datasheet

Bulk 115 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-312-41-004101 Preci-Dip Sockets for ICs, Transistors

116-87-312-41-004101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip
3,325 -

RFQ

FudongIC

Datasheet

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-420-41-105101 Preci-Dip Sockets for ICs, Transistors

110-83-420-41-105101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
2,021 -

RFQ

FudongIC

Datasheet

Bulk 110 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-624-31-012101 Preci-Dip Sockets for ICs, Transistors

614-87-624-31-012101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
2,127 -

RFQ

FudongIC

Datasheet

Bulk 614 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-83-308-10-001101 Preci-Dip Sockets for ICs, Transistors

299-83-308-10-001101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip
2,576 -

RFQ

FudongIC

Datasheet

Bulk 299 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-87-422-41-001101 Preci-Dip Sockets for ICs, Transistors

612-87-422-41-001101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
2,496 -

RFQ

FudongIC

Datasheet

Bulk 612 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-314-41-801101 Preci-Dip Sockets for ICs, Transistors

110-83-314-41-801101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip
2,755 -

RFQ

FudongIC

Datasheet

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-320-41-007101 Preci-Dip Sockets for ICs, Transistors

116-87-320-41-007101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
2,286 -

RFQ

FudongIC

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-420-41-007101 Preci-Dip Sockets for ICs, Transistors

116-87-420-41-007101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
3,164 -

RFQ

FudongIC

Datasheet

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-420-41-006101 Preci-Dip Sockets for ICs, Transistors

116-83-420-41-006101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
2,961 -

RFQ

FudongIC

Datasheet

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
20-3518-10T Aries Electronics Sockets for ICs, Transistors

20-3518-10T

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics
3,313 -

RFQ

FudongIC

Datasheet

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-83-312-41-011101 Preci-Dip Sockets for ICs, Transistors

116-83-312-41-011101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip
3,684 -

RFQ

FudongIC

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-056-09-041101 Preci-Dip Sockets for ICs, Transistors

510-87-056-09-041101

CONN SOCKET PGA 56POS GOLD

Preci-Dip
2,480 -

RFQ

FudongIC

Datasheet

Bulk 510 Active PGA 56 (9 x 9) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-322-41-001101 Preci-Dip Sockets for ICs, Transistors

614-83-322-41-001101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
3,350 -

RFQ

FudongIC

Datasheet

Bulk 614 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-87-636-41-117101 Preci-Dip Sockets for ICs, Transistors

114-87-636-41-117101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip
3,307 -

RFQ

FudongIC

Datasheet

Bulk 114 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-316-41-001101 Preci-Dip Sockets for ICs, Transistors

116-87-316-41-001101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip
2,485 -

RFQ

FudongIC

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-328-41-005101 Preci-Dip Sockets for ICs, Transistors

110-83-328-41-005101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
2,504 -

RFQ

FudongIC

Datasheet

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-318-41-008101 Preci-Dip Sockets for ICs, Transistors

116-87-318-41-008101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip
3,065 -

RFQ

FudongIC

Datasheet

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-87-328-41-001101 Preci-Dip Sockets for ICs, Transistors

612-87-328-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,812 -

RFQ

FudongIC

Datasheet

Bulk 612 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-87-628-41-001101 Preci-Dip Sockets for ICs, Transistors

612-87-628-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,865 -

RFQ

FudongIC

Datasheet

Bulk 612 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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