Sockets for ICs, Transistors

Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
126-91-310-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

126-91-310-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,644 -

RFQ

FudongIC

Datasheet

Tube 126 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
32-6513-11H Aries Electronics Sockets for ICs, Transistors

32-6513-11H

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics
2,766 -

RFQ

FudongIC

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-41-210-41-008000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-41-210-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,902 -

RFQ

FudongIC

Datasheet

Tube 116 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-210-41-008000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-91-210-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,209 -

RFQ

FudongIC

Datasheet

Tube 116 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-41-310-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

115-41-310-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,338 -

RFQ

FudongIC

Datasheet

Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-91-310-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

115-91-310-41-001000

SKT IC OPEN LOWPRO

Mill-Max Manufacturing Corp.
2,065 -

RFQ

FudongIC

Datasheet

Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
517-87-265-12-000111 Preci-Dip Sockets for ICs, Transistors

517-87-265-12-000111

CONN SOCKET PGA 265POS GOLD

Preci-Dip
3,310 -

RFQ

FudongIC

Datasheet

Bulk 517 Active PGA 265 (12 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-99-210-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

110-99-210-41-001000

CONN IC DIP SOCKET 10POS TINLEAD

Mill-Max Manufacturing Corp.
2,355 -

RFQ

FudongIC

Datasheet

Tube 110 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-44-210-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

110-44-210-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,844 -

RFQ

FudongIC

Datasheet

Tube 110 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
546-87-133-14-002135 Preci-Dip Sockets for ICs, Transistors

546-87-133-14-002135

CONN SOCKET PGA 133POS GOLD

Preci-Dip
2,155 -

RFQ

FudongIC

Datasheet

Bulk 546 Active PGA 133 (14 x 14) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
546-87-133-14-002136 Preci-Dip Sockets for ICs, Transistors

546-87-133-14-002136

CONN SOCKET PGA 133POS GOLD

Preci-Dip
3,246 -

RFQ

FudongIC

Datasheet

Bulk 546 Active PGA 133 (14 x 14) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-83-640-10-002101 Preci-Dip Sockets for ICs, Transistors

299-83-640-10-002101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip
3,761 -

RFQ

FudongIC

Datasheet

Bulk 299 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-93-632-10-002000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

299-93-632-10-002000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.
3,070 -

RFQ

FudongIC

Datasheet

Tube 299 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-13-304-61-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

110-13-304-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,065 -

RFQ

Tube * Active - - - - - - - - - - - - - -
614-41-310-31-002000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

614-41-310-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,116 -

RFQ

FudongIC

Datasheet

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-310-31-002000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

614-91-310-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,383 -

RFQ

FudongIC

Datasheet

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
48-6513-10H Aries Electronics Sockets for ICs, Transistors

48-6513-10H

CONN IC DIP SOCKET 48POS GOLD

Aries Electronics
3,569 -

RFQ

FudongIC

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
614-93-310-31-012000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

614-93-310-31-012000

SOCKET CARRIER LOWPRO .300 10POS

Mill-Max Manufacturing Corp.
3,694 -

RFQ

FudongIC

Datasheet

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-310-31-012000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

614-43-310-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,765 -

RFQ

FudongIC

Datasheet

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-83-261-18-071101 Preci-Dip Sockets for ICs, Transistors

510-83-261-18-071101

CONN SOCKET PGA 261POS GOLD

Preci-Dip
3,743 -

RFQ

FudongIC

Datasheet

Bulk 510 Active PGA 261 (18 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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