Sockets for ICs, Transistors

Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
210-91-306-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

210-91-306-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,465 -

RFQ

FudongIC

Datasheet

Tube 210 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-91-210-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

110-91-210-41-001000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.
3,959 -

RFQ

FudongIC

Datasheet

Tube 110 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-41-210-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

110-41-210-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,397 -

RFQ

FudongIC

Datasheet

Tube 110 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-41-310-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-41-310-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,108 -

RFQ

FudongIC

Datasheet

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-310-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-91-310-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,350 -

RFQ

FudongIC

Datasheet

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
APA-316-G-C Samtec Inc. Sockets for ICs, Transistors

APA-316-G-C

ADAPTER PLUG

Samtec Inc.
3,425 -

RFQ

Bulk APA Active - 16 (2 x 8) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
210-43-310-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

210-43-310-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,074 -

RFQ

FudongIC

Datasheet

Tube 210 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
210-93-310-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

210-93-310-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,094 -

RFQ

FudongIC

Datasheet

Tube 210 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
714-43-145-31-018000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

714-43-145-31-018000

CONN SOCKET SIP 45POS GOLD

Mill-Max Manufacturing Corp.
2,250 -

RFQ

FudongIC

Datasheet

Bulk 714 Active SIP 45 (1 x 45) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
317-47-107-41-005000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

317-47-107-41-005000

STANDRD SOLDRTL SNG SKT

Mill-Max Manufacturing Corp.
3,968 -

RFQ

FudongIC

Datasheet

Bulk 317 Active SIP 7 (1 x 7) 0.070 (1.78mm) Gold Flash Beryllium Copper Through Hole - Solder 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
121-11-310-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

121-11-310-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,089 -

RFQ

FudongIC

Datasheet

Tube 121 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
111-41-310-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

111-41-310-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,542 -

RFQ

FudongIC

Datasheet

Tube 111 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
111-91-310-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

111-91-310-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,441 -

RFQ

FudongIC

Datasheet

Tube 111 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
517-87-280-18-101111 Preci-Dip Sockets for ICs, Transistors

517-87-280-18-101111

CONN SOCKET PGA 280POS GOLD

Preci-Dip
3,578 -

RFQ

FudongIC

Datasheet

Bulk 517 Active PGA 280 (18 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-43-310-31-002000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

614-43-310-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,569 -

RFQ

FudongIC

Datasheet

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-93-310-31-002000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

614-93-310-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,111 -

RFQ

FudongIC

Datasheet

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
514-87-127-16-091117 Preci-Dip Sockets for ICs, Transistors

514-87-127-16-091117

CONN SOCKET PGA 127POS GOLD

Preci-Dip
2,847 -

RFQ

FudongIC

Datasheet

Bulk 514 Active PGA 127 (16 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-93-310-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

123-93-310-41-001000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.
3,901 -

RFQ

FudongIC

Datasheet

Tube 123 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-43-310-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

123-43-310-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,965 -

RFQ

FudongIC

Datasheet

Tube 123 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
APA-314-G-P Samtec Inc. Sockets for ICs, Transistors

APA-314-G-P

ADAPTER PLUG

Samtec Inc.
3,123 -

RFQ

Tube APA Active - 14 (2 x 7) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
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