Sockets for ICs, Transistors

Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
121-13-310-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

121-13-310-41-001000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.
3,883 -

RFQ

FudongIC

Datasheet

Tube 121 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-47-310-41-006000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-47-310-41-006000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.
3,474 -

RFQ

FudongIC

Datasheet

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
APA-640-T-N Samtec Inc. Sockets for ICs, Transistors

APA-640-T-N

ADAPTER PLUG

Samtec Inc.
3,722 -

RFQ

Tube APA Active - 40 (2 x 20) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
714-43-242-31-018000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

714-43-242-31-018000

CONN IC DIP SOCKET 42POS GOLD

Mill-Max Manufacturing Corp.
2,189 -

RFQ

FudongIC

Datasheet

Bulk 714 Active DIP, 0.1 (2.54mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
APA-322-G-A Samtec Inc. Sockets for ICs, Transistors

APA-322-G-A

ADAPTER PLUG

Samtec Inc.
3,779 -

RFQ

Bulk APA Active - 22 (2 x 11) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
APA-422-G-A Samtec Inc. Sockets for ICs, Transistors

APA-422-G-A

ADAPTER PLUG

Samtec Inc.
2,329 -

RFQ

Bulk APA Active - 22 (2 x 11) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
110-93-210-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

110-93-210-41-001000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.
2,308 -

RFQ

FudongIC

Datasheet

Tube 110 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-43-210-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

110-43-210-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,553 -

RFQ

FudongIC

Datasheet

Tube 110 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
07-0511-11 Aries Electronics Sockets for ICs, Transistors

07-0511-11

CONN SOCKET SIP 7POS GOLD

Aries Electronics
3,841 -

RFQ

FudongIC

Datasheet

Bulk 511 Active SIP 7 (1 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
104-13-210-41-770000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

104-13-210-41-770000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.
3,545 -

RFQ

FudongIC

Datasheet

Tube 104 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic
114-47-308-41-117000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

114-47-308-41-117000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.
2,203 -

RFQ

FudongIC

Datasheet

Tube 114 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-91-308-41-003000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

115-91-308-41-003000

SOCKET IC OPEN LOWPRO .300 8POS

Mill-Max Manufacturing Corp.
2,378 -

RFQ

Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Thermoplastic
115-41-308-41-003000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

115-41-308-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,282 -

RFQ

FudongIC

Datasheet

Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-304-61-006000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-43-304-61-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,276 -

RFQ

Tube * Active - - - - - - - - - - - - - -
116-93-304-61-006000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-93-304-61-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,533 -

RFQ

Tube * Active - - - - - - - - - - - - - -
122-11-310-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

122-11-310-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,840 -

RFQ

FudongIC

Datasheet

Tube 122 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
210-11-306-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

210-11-306-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,598 -

RFQ

FudongIC

Datasheet

Tube 210 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
146-41-306-41-012000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

146-41-306-41-012000

CONN SKT DBL

Mill-Max Manufacturing Corp.
2,471 -

RFQ

FudongIC

Datasheet

Tube 146 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
146-91-306-41-012000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

146-91-306-41-012000

CONN SKT DBL

Mill-Max Manufacturing Corp.
2,560 -

RFQ

FudongIC

Datasheet

Tube 146 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-41-308-41-605000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

110-41-308-41-605000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,387 -

RFQ

FudongIC

Datasheet

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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